AD9528 datasheet(16/68 Pages) AD

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Data Sheet

AD9528

Rev. C | Page 15 of 67

ABSOLUTE MAXIMUM RATINGS

Table 19.

Parameter

Rating

VDD

−0.3 V to +3.6 V

REFA, REFA, REFB, REFB, VCXO_IN,

VCXO_IN, SYSREF_IN, SYSREF_IN,

SYSREF_REQ to GND

−0.3 V to +3.6 V

SCLK/SCL, SDIO/SDA, SDO, CS to GND

−0.3 V to +3.6 V

RESET, REF_SEL, SYSREF_REQ to GND

−0.3 V to +3.6 V

STATUS0/SP0, STATUS1/SP1 to GND

−0.3 V to +3.6 V

Junction Temperature

125°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature (10 sec)

300°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 20. Thermal Resistance

Package Type

Airflow

Velocity

(m/sec)

θJA1,2

θJC1,3

θJB1,4

1, 2

Unit

72-Lead LFCSP,

10 mm ×

10 mm

21.3

1.7

12.6

0.1

°C/W

1.0

20.1

0.2

°C/W

2.5

18.1

0.3

°C/W

1 Per JEDEC 51-7, plus JEDEC 51-5 2S2P test board.

2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).

3 Per MIL-Std 883, Method 1012.1.

4 Per JEDEC JESD51-8 (still air).

Additional power dissipation information can be found in the

Power Dissipation and Thermal Considerations section.

ESD CAUTION

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