SC16C652 datasheet(38/41 Pages) PHILIPS

38 / 41 page

Philips Semiconductors

SC16C652

Dual UART with 32 bytes of transmit and receive FIFOs

Product data

Rev. 04 — 20 June 2003

38 of 41

9397 750 11634

• For packages with leads on two sides and a pitch (e):

– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be

parallel to the transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the

transport direction of the printed-circuit board.

The footprint must incorporate solder thieves at the downstream end.

• For packages with leads on four sides, the footprint must be placed at a 45

° angle

to the transport direction of the printed-circuit board. The footprint must

incorporate solder thieves downstream and at the side corners.

During placement and before soldering, the package must be ﬁxed with a droplet of

adhesive. The adhesive can be applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250

°C or

265

°C, depending on solder material applied, SnPb or Pb-free respectively.

A mildly-activated ﬂux will eliminate the need for removal of corrosive residues in

most applications.

12.4 Manual soldering

Fix the component by ﬁrst soldering two diagonally-opposite end leads. Use a low

voltage (24 V or less) soldering iron applied to the ﬂat part of the lead. Contact time

must be limited to 10 seconds at up to 300

°C.

When using a dedicated tool, all other leads can be soldered in one operation within

2 to 5 seconds between 270 and 320

°C.

12.5 Package related soldering information

[1]

For more detailed information on the BGA packages refer to the

(LF)BGA Application Note

(AN01026); order a copy from your Philips Semiconductors sales ofﬁce.

[2]

All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the

maximum temperature (with respect to time) and body size of the package, there is a risk that internal

or external package cracks may occur due to vaporization of the moisture in them (the so called

popcorn effect). For details, refer to the Drypack information in the

Data Handbook IC26; Integrated

Circuit Packages; Section: Packing Methods.

Table 30:

Suitability of surface mount IC packages for wave and reﬂow soldering

methods

Package[1]

Soldering method

Wave

Reﬂow[2]

BGA, LBGA, LFBGA, SQFP, SSOP-T[3],

TFBGA, VFBGA

not suitable

suitable

DHVQFN, HBCC, HBGA, HLQFP, HSQFP,

HSOP, HTQFP, HTSSOP, HVQFN, HVSON,

SMS

not suitable[4]

suitable

PLCC[5], SO, SOJ

suitable

LQFP, QFP, TQFP

not recommended[5][6]

suitable

SSOP, TSSOP, VSO, VSSOP

not recommended[7]

suitable

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