MPC8548ECPXATHC datasheet(134/151 Pages) FREESCALE

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MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9

134

Freescale Semiconductor

Thermal

21 Thermal

This section describes the thermal specifications of the device.

21.1

Thermal for Version 2.0 Silicon HiCTE FC-CBGA with Full Lid

This section describes the thermal specifications for the HiCTE FC-CBGA package for revision 2.0

silicon.

This table shows the package thermal characteristics.

21.2

Thermal for Version 2.1.1, 2.1.2, and 2.1.3 Silicon FC-PBGA with

Full Lid and Version 3.1.x Silicon with Stamped Lid

This section describes the thermal specifications for the FC-PBGA package for revision 2.1.1, 2.1.2, and

3.0 silicon.

This table shows the package thermal characteristics.

Table 84. Package Thermal Characteristics for HiCTE FC-CBGA

Characteristic

JEDEC Board

Symbol

Value

Unit

Notes

Die junction-to-ambient (natural convection)

Single-layer board (1s)

RJA

°C/W

1, 2

Die junction-to-ambient (natural convection)

Four-layer board (2s2p)

RJA

°C/W

1, 2

Die junction-to-ambient (200 ft/min)

Single-layer board (1s)

RJA

°C/W

1, 2

Die junction-to-ambient (200 ft/min)

Four-layer board (2s2p)

RJA

8°C/W

1, 2

Die junction-to-board

N/A

RJB

3°C/W3

Die junction-to-case

N/A

RJC

0.8

°C/W

Notes:

1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal

resistance.

2. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.

3. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

4. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method

1012.1). The cold plate temperature is used for the case temperature, measured value includes the thermal resistance of the

interface layer.

Table 85. Package Thermal Characteristics for FC-PBGA

Characteristic

JEDEC Board

Symbol

Value

Unit

Notes

Die junction-to-ambient (natural convection)

Single-layer board (1s)

RJA

°C/W

1, 2

Die junction-to-ambient (natural convection)

Four-layer board (2s2p)

RJA

°C/W

1, 2

Die junction-to-ambient (200 ft/min)

Single-layer board (1s)

RJA

°C/W

1, 2

Die junction-to-ambient (200 ft/min)

Four-layer board (2s2p)

RJA

9°C/W

1, 2

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