AMC7812SPAPR datasheet(2/92 Pages) TI

2 / 92 page

AMC7812

SBAS513E – JANUARY 2011 – REVISED SEPTEMBER 2013

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PACKAGE/ORDERING INFORMATION(1)

MAXIMUM

RELATIVE

DIFFERENTIAL

SPECIFIED

ACCURACY

NONLINEARITY

PACKAGE-

PACKAGE

TEMPERATURE

PACKAGE

PRODUCT

(LSB)

LEAD

DESIGNATOR

RANGE

MARKING

QFN-64

RGC

–40°C to +105°C

AMC7812

±1

HTQFP-64

PAP

–40°C to +105°C

AMC7812

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the

device product folder at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range, unless otherwise noted.

AMC7812

UNIT

AVDD to GND

–0.3 to +6

DVDD to GND

–0.3 to +6

IOVDD to GND

–0.3 to +6

AVCC to GND

–0.3 to +18

DVDD to DGND

–0.3 to +6

Analog input voltage to GND

–0.3 to AVDD + 0.3

ALARM, GPIO-0, GPIO-1, GPIO-2, GPIO-3, SCLK/SCL, and SDI/SDA to GND

–0.3 to +6

D1+/GPIO-4, D1–/GPIO-5, D2+/GPIO-6, D2–/GPIO-7 to GND

–0.3 to AVDD + 0.3

Digital input voltage to DGND

–0.3 to IOVDD + 0.3

SDO and DAV to GND

–0.3 to IOVDD + 0.3

Operating temperature range

–40 to +105

°C

Storage temperature range

–40 to +150

°C

Junction temperature range (TJ max)

+150

°C

Human body model (HBM)

2.5

ESD ratings

Charged device model (CDM)

1.0

(1)

Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute

maximum conditions for extended periods may affect device reliability.

THERMAL INFORMATION

AMC7812

THERMAL METRIC(1)

RGC (QFN)

PAP (HTQFP)

UNITS

64 PINS

θJA

Junction-to-ambient thermal resistance

24.1

33.7

θJCtop

Junction-to-case (top) thermal resistance

8.1

9.5

θJB

Junction-to-board thermal resistance

3.2

9.0

°C/W

ψJT

Junction-to-top characterization parameter

0.1

0.3

ψJB

Junction-to-board characterization parameter

3.3

8.9

θJCbot

Junction-to-case (bottom) thermal resistance

0.6

0.2

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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