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STM32H533CE датащи(PDF) 226 Page - STMicroelectronics

номер детали STM32H533CE
подробное описание детали  Arm® Cortex®-M33 32-bit MCUTrustZone® FPU, 375 DMIPS 250 MHz, 512-Kbyte flash, 272-Kbyte RAM, cryptography
PDF  231 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
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STM32H533CE датащи(HTML) 226 Page - STMicroelectronics

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Package information
STM32H533xx
226/231
DS14539 Rev 1
6.10
Package thermal characteristics
The maximum chip-junction temperature, TJmax in degrees Celsius, can be calculated using
the following equation:
TJmax = TAmax + (PDmax × ΘJA)
Where:
•
TAmax is the maximum ambient temperature in °C,
•
ΘJA is the package junction-to-ambient thermal resistance, in °C/W,
•
PDmax is the sum of PINTmax and PI/Omax (PDmax = PINTmax + PI/Omax),
•
PINTmax is the product of IDD and VDD, expressed in Watts. This is the maximum chip
internal power.
PI/Omax represents the maximum power dissipation on output pins:
PI/Omax = Σ (VOL × IOL) + Σ((VDD – VOH) × IOH),
taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the
application.
Table 130. Package thermal characteristics
Symbol
Definition
Parameter
Value
Unit
ΘJA
Thermal resistance
junction-ambient
WLCSP39 (2.76 x 2.78 mm)
65.3
°C/W
UFQFPN48 (7 x 7 mm)
28.5
LQFP48 (7 x 7 mm)
51.2
LQFP64 (10 x 10 mm)
44.2
LQFP100 (14 x 14 mm)
36.4
UFBGA100 (7 x 7 mm)
50
LQFP144 (20 x 20 mm)
37.9
UFBGA144 (10 x 10 mm)
45.5
ΘJB
Thermal resistance
junction-board
WLCSP39 (2.76 x 2.78 mm)
38
°C/W
UFQFPN48 (7 x 7 mm)
12.9
LQFP48 (7 x 7 mm)
28.6
LQFP64 (10 x 10 mm)
26.6
LQFP100 (14 x 14 mm)
22.3
UFBGA100 (7 x 7 mm)
35.8
LQFP144 (20 x 20 mm)
26.7
UFBGA144 (10 x 10 mm)
33.4



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