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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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STM32H533CE датащи(PDF) 217 Page - STMicroelectronics |
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STM32H533CE датащи(HTML) 217 Page - STMicroelectronics |
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217 / 231 page  DS14539 Rev 1 217/231 STM32H533xx Package information 227 Notes: 1. Dimensioning and tolerancing schemes conform to ASME Y14.5M-2009 apart European projection. 2. UFBGA stands for ulta profile fine pitch ball grid array: 0.50 mm < A ≤ 0.65 mm / fine pitch e < 1.00 mm. 3. The profile height, A, is the distance from the seating plane to the highest point on the package. It is measured perpendicular to the seating plane. 4. A1 is defined as the distance from the seating plane to the lowest point on the package body. 5. Dimension b is measured at the maximum diameter of the terminal (ball) in a plane parallel to primary datum C. 6. BSC stands for BASIC dimensions. It corresponds to the nominal value and has no tolerance. For tolerances refer to form and position table. On the drawing these dimensions are framed. 7. Primary datum C is defined by the plane established by the contact points of three or more solder balls that support the device when it is placed on top of a planar surface. 8. The terminal (ball) A1 corner must be identified on the top surface of the package by using a corner chamfer, ink or metalized markings, or other feature of package body or Table 125. UFBGA100 - Mechanical data Symbol millimeters(1) inches(12) Min. Typ. Max. Min. Typ. Max. A(2)(3) - - 0.60 - - 0.0236 A1(4) 0.05 - - 0.0020 - - A2 - 0.43 - - 0.0169 - b(5) 0.23 0.28 0.33 0.0090 0.0110 0.0130 D(6) 7.00 BSC 0.2756 BSC D1 5.50 BSC 0.2165 BSC E 7.00 BSC 0.2756 BSC E1 5.50 BSC 0.2165 BSC e(9) 0.50 BSC 0.0197 BSC N(11) 100 SD(12) 0.25 BSC 0.0098 BSC SE(12) 0.25 BSC 0.0098 BSC aaa 0.15 0.0059 ccc 0.20 0.0079 ddd 0.08 0.0031 eee 0.15 0.0059 fff 0.05 0.0020 |
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