NOTES:

1.

All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2.

This drawing is subject to change without notice.

3.

The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

PACKAGE OUTLINE

www.ti.com

4219125 / A 10/2016

WQFN - 0.8 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

RTJ0020D

0.1

C A B

0.05

C

4.1

3.9

4.1

3.9

B

A

PIN 1 INDEX AREA

C

0.8 MAX

0.05

0.00

SEATING PLANE

20X

0.29

0.19

20

PIN 1 ID

(OPTIONAL)

EXPOSED

THERMAL PAD

SYMM

SYMM

(A) TYP

0.08 C

16X 0.5

15

1

DIM A

OPT 1

OPT 2

(0.1)

(0.2)

16

11

5

6

10

21

4X 2

20X

0.5

0.3