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SCBA017D датащи(PDF) 22 Page - Texas Instruments |
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SCBA017D датащи(HTML) 22 Page - Texas Instruments |
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22 / 34 page ![]() Tocurrentsense circuitry InductorPCBpads InductorPCBpads Tocurrentsense circuitry Right! Wrong! UCD7232 SLUSAH3 – MAY 2011 www.ti.com INDUCTOR CURRENT SENSE TRACE LAYOUT Since matching of the L/DCR to RC time constants is important to obtain an accurate replica of the inductor current, the PCB layout must be done correctly to insure that the voltage drop across the inductor is sensed properly. For best results, the current sensing connections should be made by separate, non-current-carrying traces that connect directly to the inductor solder pads. The sensing connections should not be made to current carrying traces that lead to the switching node or the output capacitors. An example of a correct and incorrect layout is given in Figure 8. Figure 8. Inductor Current Sense Trace Layout The current carrying traces have finite resistance that exhibit an additional voltage drop which will contaminate the sensed readings. It represents an additional DCR that is not taken into account in the current sensing equations. The trace resistance varies with the thickness of the PCB copper used on the board. This thickness can vary from batch to batch of pc boards, so the additional resistance of the traces is not a tightly controlled value. Even a short length of PCB trace can introduce a significant amount of added resistance. Remember, milliohms matter. By making a Kelvin connection to the inductor pads, the effects of PCB trace resistance can be minimized. LIMITATIONS OF DCR CURRENT SENSING The accuracy of the DCR current sense method is limited by the stability of the DCR and L values of the power inductor. In practice, the inductance value of the power inductor decreases with increasing load current. Most inductors will exhibit a 20% to 30% reduction in inductance as load current changes from no load to full rated current. The DCR sense method cannot detect inductor saturation or a cracked core, both of which cause greatly increased ac current to flow in the inductor. The resistance of the inductor windings is strongly affected by temperature. Most inductors use copper wire, and copper has a resistance temperature coefficient of approximately +3800ppm/ °C. This means that if the winding temperature of the inductor rises by 40 °C, its DCR will increase by 15.2%. This will cause the sensed voltage at CSP and CSN to increase by 15.2% as well for the same current flow. If high accuracy of measured current is important, then some form of temperature correction needs to be applied to the DCR sensed reading. This requires some form of temperature sensing and a method to correlate the sensed temperature to the actual winding temperature. Since it is impractical to place a temperature sensor inside the inductor to sense the winding temperature, a practical alternative is to sense the high-side FET device temperature. Tests have shown that a small analog- output temperature sensor placed under the high-side FET on the back side of the board works well as a substitute. Its temperature output correlates strongly to the inductor winding temperature. The voltage proportional to temperature can be fed to the Temp input of the UCD92xx family of Digital Power Controllers. The firmware internal to the controller can use the temperature reading to correct for the temperature effects on the DCR current sense readings. 22 Copyright © 2011, Texas Instruments Incorporated |
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