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SPSB081 датащи(PDF) 40 Page - STMicroelectronics |
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SPSB081 датащи(HTML) 40 Page - STMicroelectronics |
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40 / 137 page ![]() Figure 25. Thermal clusters identification 1 32 NRESET DO RxD_C V1 CLK RXD_L DI CSN OUT1 OUT2 VS DIR/WU2 V2 OUT3 OUT4 WU1 32 1 OUT1 OUT2 VS DIR/WU2 V2 OUT3 OUT4 RxD_C NRESET DO CLK DI CSN NC V1 WU1 1 Thermal_Cluster 1 Thermal_Cluster 2 Thermal_Cluster 3 Thermal_Cluster 4 Table 11. Thermal cluster definition Th_CL1 Th_CL2 Th_CL3 Th_CL4 V1 V2 OUT1, OUT2, OUT3, OUT4 Global TW and TSD1, TSD2 TW and TSD1 TW and TSD1 TW and TSD1 3.22 Functional safety management Even if not designed as safety HW element, the device contains some features that can be used to support application that needs to fulfill functional safety requirements. Analysis of the IC’s capability to reach the required safety level, should be made at system level under user responsibility. The following device safety requirements have been considered for a typical application: Table 12. Safety requirement ID Description TSR1 SPSB081 shall guarantee the correct operation of the voltage regulator V1 as specified in datasheet. TSR2 SPSB081 shall guarantee the correct operation of the voltage regulator V2 as specified in datasheet. SPSB081 Functional safety management DS14048 - Rev 3 page 40/137 |
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