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MFS5600AMBAFES датащи(PDF) 12 Page - NXP Semiconductors |
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MFS5600AMBAFES датащи(HTML) 12 Page - NXP Semiconductors |
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12 / 118 page ![]() NXP Semiconductors FS5600 Automotive buck regulator and controller with voltage monitors and watchdog timer 9 Thermal characteristics Symbol Description (Rating) Min Max Unit TA Ambient Operating Temperature Range (Automotive) –40 125 °C TA Ambient Operating Temperature Range (Industrial) –40 105 °C TJ Operating Junction Temperature Range –40 150 °C TPPRT Peak package reflow temperature — 260 °C TST Storage Temperature Range –55 150 °C Table 5. Temperature range Rating Board Type Symbol Value Unit Junction to Ambient Thermal Resistance[1] JESD51-9, 2s2p RθJA 36.3 °C/W Junction-to-Top of Package Thermal Characterization Parameter[1] JESD51-9, 2s2p ΨJT 4.5 °C/W Junction to Ambient Thermal Resistance[1] Customized, 2s4p RθJA 31.7 °C/W Junction-to-Top of Package Thermal Characterization Parameter[1] Customized, 2s4p ΨJT 4.4 °C/W Junction to Ambient Thermal Resistance[1] Customized, 2s6p RθJA 29.4 °C/W Junction-to-Top of Package Thermal Characterization Parameter[1] Customized, 2s6p ΨJT 4.4 °C/W Table 6. QFN32 thermal resistance and package dissipation ratings [1] Determined in accordance to JEDEC JESD51-2A natural convection environment. Thermal resistance data in this report is solely for a thermal performance comparison of one package to another in a standardized specified environment. It is not meant to predict the performance of a package in an application-specific environment. Normal practice assumes uniform heating on the die. When higher power density occurs in localized areas, there are significant hot spots on the die. FS5600 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved. Product data sheet Rev. 4 — 29 April 2024 12 / 118 |
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