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FS6407 датащи(PDF) 52 Page - NXP Semiconductors

номер детали FS6407
подробное описание детали  Power system basis chip with high speed can transceiver
PDF  111 Pages
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производитель  NXP [NXP Semiconductors]
домашняя страница  http://www.nxp.com
Logo NXP - NXP Semiconductors

FS6407 датащи(HTML) 52 Page - NXP Semiconductors

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NXP Semiconductors
FS6407/FS6408
Figure 36. VAUX current limitation scheme with foldback mechanism
6.7.5.2
Voltage monitoring
The overvoltage detection switches OFF the regulator. The regulator remains ON in case of an undervoltage detection. A diagnostic is
reported in the dedicated register, generating an Interrupt, and may bring the application into Fail-safe state depending on the supervisor
configuration (registers INIT SUPERVISOR 1, 2, 3).
6.7.6
CAN_5V voltage regulator
The CAN_5V voltage regulator is a linear regulator fully dedicated to the internal HSCAN interface. By default, the CAN_5V regulator and
the undervoltage detector are enabled, and the overvoltage detector is disabled. The overvoltage detector can be enabled by the SPI
during INIT_MAIN sate.
If the overvoltage detector is enabled, the CAN_5V regulator switches OFF when an overvoltage is detected. The undervoltage detector
is disabled when the regulator is switched OFF reporting an undervoltage. A diagnostic is reported in the dedicated register, generating
an Interrupt. The CAN_5V regulator is not a safety regulator. Consequently, the CAN_5V voltage monitoring (overvoltage, undervoltage)
never asserts RSTB or the FS0B Fail-safe pins.
If the FS6407/FS6408 internal CAN transceiver is not used in the application, the CAN_5V regulator can be used to supply an external
load, provided the current load remains below the maximum current capability in all conditions. In that case, the internal CAN transceiver
must be put in Sleep mode without wake-up capability.
6.7.7
Power dissipation
The FS6407/FS6408 provides high performance SMPS and Linear regulators to supply high end MCU in industrial applications. Each
regulator can deliver:
•VPRE (6. 5V) up to 2.0 A
•VCORE (from 1.2 V to 3.3 V range) up to 0.8 A (FS6407) or up to 1.5 A (FS6408)
•VCCA (3.3 V or 5.0 V) up to 100 mA (with internal MOS) or up to 300 mA (with external PNP)
•VAUX (3.3 V or 5.0 V) up to 300 mA (with external PNP)
•VCAN (5.0 V) up to 100 mA
A thermal dissipation analysis has to be performed based on application use case to ensure the maximum silicon junction temperature
does not exceed 150 °C.
Two use cases covering the two main VCORE voltage configurations are provided in Figure 37.
• use case 1: VCORE = 3.3 V, ICORE = 0.7 A, VCCA with int. MOS
• use case 2: VCORE = 1.2 V, ICORE = 1.4 A, VCCA with ext. PNP
Both use cases have a total internal power dissipation below 0.9 W. A junction to ambient thermal resistivity of 30 °C/W allows the
application to work up to 125 °C ambient temperature. A good soldering of the package expose pad is highly recommended to achieve
such thermal performance.
Iaux_LIM
Iaux_LIM_FB
IAUX
VAUX
Vaux
(3.3Vor
5V)
Vaux_LIM_FB



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