ECE1200 datasheet(14/87 Pages) MICROCHIP

номер детали	ECE1200

подробное описание детали	eSPI to LPC Bridge

PDF	87 Pages

Scroll/Zoom	100%

производитель	MICROCHIP [Microchip Technology]

домашняя страница	http://www.microchip.com

Logo

14 / 87 page

ECE1200

DS00003093C Draft-page 14

 2018-2021 Microchip Technology Inc.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Pin 1 visual index feature may vary, but must be located within the hatched area.

Package is saw singulated

Dimensioning and tolerancing per ASME Y14.5M

Microchip Technology Drawing C04-496 Rev A Sheet 2 of 2

40-Lead Very Thin Plastic Quad Flat, No Lead Package (LDX) - 5x5 mm Body [VQFN]

With 2.7x2.7 mm Exposed Pad

Number of Terminals

Overall Height

Terminal Width

Overall Width

Terminal Length

Exposed Pad Width

Terminal Thickness

Pitch

Standoff

Units

Dimension Limits

0.40 BSC

0.20 REF

2.60

0.30

0.15

0.80

0.00

0.20

0.40

2.70

0.85

0.02

5.00BSC

MILLIMETERS

MIN

NOM

2.80

0.50

0.30

0.90

0.05

MAX

0.75 REF

Terminal-to-Exposed-Pad

Overall Length

Exposed Pad Length

2.60

5.00BSC

2.70

2.80

ECE1200 датащи(PDF) 14 Page - Microchip Technology

ECE1200 датащи(HTML) 14 Page - Microchip Technology

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87

датащи скачать

ссылки URL