ECE1200 datasheet(63/87 Pages) MICROCHIP

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DS00003093C Draft-page 63

ECE1200

8.3

Power Consumption

TABLE 8-9:

THERMAL PACKAGING CHARACTERISTICS

Characteristics

Symbol Typical

Max.

Unit

Notes

Package Thermal Resistance, 40-pin VQFN (LDX)

JA

50.0

—

°C/W

1, 2

JC

9.4

—

°C/W

JB

31.0

—

°C/W

Note 1: Thermal resistance values are determined by packaging simulations.

JA as listed here assumes airflow of 0 m/s.

Note:

These values are PRELIMINARY, pending characterization.

TABLE 8-10:

SUPPLY CURRENT

Case

Device State

Supply Rail

Typical

(nom V,

25° C)

Max

(max V,

70° C)

Max

(max V,

85° C)

Units

Full On, Active LPC Traffic,

with both LPC Clocks Running

VTR_33

11.45

VTR_18

VTR_CORE_18

1.25

Full On, Active LPC Traffic,

with one LPC Clock Running

VTR_33

TBD

VTR_18

VTR_CORE_18

1.25

LPC Idle, Clocks Off:

due to CLKRUN# High or

Clocks explicitly turned off

VTR_33

2.0

VTR_18

2.3

VTR_CORE_18

0.9

LPC On and Reset:

LPC_EN High, PLTRST# Low,

Both LPC Clocks Running (forced).

(Transient State during Host Boot)

VTR_33

11.1

VTR_18

2.2

VTR_CORE_18

1.06

Light Sleep

LPC Clocks off and

Gated Clock mode selected

(IDLE_GATEOSC bit on).

VTR_33

2.0

VTR_18

2.3

VTR_CORE_18

0.44

Deep Sleep

Host C10 / S0ix State with

Disabled Internal Oscillator

mode selected

(VW_C10_STOPOSC bit on).

VTR_33

2.0

VTR_18

2.3

VTR_CORE_18

3.6

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