FXLS8974CF datasheet(95/96 Pages) NXP

95 / 96 page

NXP Semiconductors

FXLS8974CF

3-Axis Low-g Accelerometer

Contents

General description ............................................ 1

Features and benefits .........................................1

Applications .........................................................2

3.1

Industrial IOT ..................................................... 2

3.2

Medical ...............................................................2

3.3

Consumer devices .............................................2

Ordering information .......................................... 2

4.1

Ordering options ................................................ 2

Block diagram ..................................................... 3

Pinning information ............................................ 4

6.1

Pinning ...............................................................4

6.2

Pinning description ............................................ 4

6.3

Orientation ......................................................... 6

Limiting values ....................................................6

Recommended operating conditions ................ 7

Mechanical characteristics ................................ 7

Electrical characteristics ....................................9

Temperature sensor characteristics ................11

I2C digital interface ...........................................11

12.1

I2C interface characteristics ............................ 12

12.1.1

General I2C operation ..................................... 13

12.1.2

I2C read/write operations ................................ 14

12.1.2.1 Single-byte read .............................................. 14

12.1.2.2 Multiple-byte read ............................................ 14

12.1.2.3 Single-byte write .............................................. 14

12.1.2.4 Multiple-byte write ............................................14

12.1.2.5 I2C data sequence diagrams ...........................15

SPI interface ...................................................... 15

13.1

General SPI operation .....................................15

13.2

SPI write operations with 3- or 4-wire mode .... 16

13.3

SPI read operations with 4-wire mode .............16

13.4

SPI read operations with 3-wire mode .............17

13.5

SPI timing specifications (4-wire mode and

3-wire hardwired modes) ................................. 18

13.6

SPI timing specifications (software enabled

3-wire mode) ....................................................19

Operating modes ...............................................20

15.1

INT_STATUS register (address 00h) ............... 30

15.2

TEMP_OUT register (address 01h) ................. 33

15.3

VECM_LSB register (address 02h) ................. 33

15.4

VECM_MSB register (address 03h) ................ 33

15.5

OUT_X_LSB, OUT_X_MSB, OUT_Y_LSB,

OUT_Y_MSB, OUT_Z_LSB, OUT_Z_MSB

registers (addresses 04h to 09h) .....................34

15.6

BUF_STATUS register (address 0Bh) ..............36

15.7

BUF_X_LSB, BUF_X_MSB, BUF_Y_LSB,

BUF_Y_MSB, BUF_Z_LSB, BUF_Z_MSB

(addresses 0Ch to 11h) ................................... 38

15.8

PROD_REV register (address 12h) .................40

15.9

WHO_AM_I register (address 13h) ................. 41

15.10

SYS_MODE register (address 14h) .................41

15.11

SENS_CONFIG1 register (address 15h) ......... 42

15.12

SENS_CONFIG2 register (address 16h) ......... 44

15.13

SENS_CONFIG3 register (address 17h) ......... 45

15.14

SENS_CONFIG4 register (address 18h) ......... 48

15.15

SENS_CONFIG5 register (address 19h) ......... 51

15.16

WAKE_IDLE_LSB register (address 1Ah) ....... 52

15.17

WAKE_IDLE_MSB register (address 1Bh) ...... 52

15.18

SLEEP_IDLE_LSB register (address 1Ch) ......53

15.19

SLEEP_IDLE_MSB register (address 1Dh) ..... 53

15.20

ASLP_COUNT_LSB, ASLP_COUNT_MSB

registers (addresses 1Eh to 1Fh) .................... 53

15.21

INT_EN register (address 20h) ........................55

15.22

INT_PIN_SEL register (address 21h) .............. 57

15.23

OFF_X, OFF_Y, OFF_Z registers

(addresses 22h to 24h) ................................... 58

15.24

BUF_CONFIG1 register (address 26h) ............59

15.25

BUF_CONFIG2 register (address 27h) ............61

15.26

ORIENT_STATUS register (address 28h) ........62

15.27

ORIENT_CONFIG register (address 29h) ....... 63

15.28

ORIENT_DBCOUNT register (address

2Ah) ................................................................. 64

15.29

ORIENT_BF_ZCOMP register (address

2Bh) ................................................................. 64

15.30

ORIENT_THS register (address 2Ch) ............. 65

15.31

Sensor Data Change Detection (SDCD)

registers ........................................................... 67

15.31.1 SDCD_INT_SRC1 register (address 2Dh) .......68

15.31.2 SDCD_INT_SRC2 register (address 2Eh) .......69

15.31.3 SDCD_CONFIG1 register (address 2Fh) .........71

15.31.4 SDCD_CONFIG2 register (address 30h) .........72

15.31.5 SDCD_OT_DBCNT register (address 31h) ..... 74

15.31.6 SDCD_WT_DBCNT register (address 32h) .....74

15.31.7 SDCD_LTHS_LSB register (address 33h) ....... 75

15.31.8 SDCD_LTHS_MSB register (address 34h) ...... 75

15.31.9 SDCD_UTHS_LSB register (address 35h) ...... 76

15.31.10 SDCD_UTHS_MSB register (address 36h) ..... 76

15.32

SELF_TEST_CONFIG1 register (address

37h) ..................................................................77

15.33

SELF_TEST_CONFIG2 register (address

38h) ..................................................................77

Application information ....................................79

16.1

System connections .........................................79

16.2

Typical application circuits ............................... 79

16.3

Power supply considerations ...........................81

Package outline .................................................82

17.1

Package description ........................................ 83

17.2

Lead dimension detail ......................................86

Soldering information .......................................86

18.1

Printed circuit board layout and device

mounting .......................................................... 86

18.1.1

Overview of soldering considerations .............. 86

18.1.2

Halogen content .............................................. 86

Mounting information ....................................... 86

19.1

PCB mounting recommendations .................... 86

Glossary .............................................................88

References .........................................................89

Revision history ................................................ 89

Legal information ..............................................90

FXLS8974CF

All information provided in this document is subject to legal disclaimers.

Objective data sheet

Rev. 1 — 27 April 2021

95 / 96

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