FXLS8974CF datasheet(87/96 Pages) NXP

87 / 96 page

NXP Semiconductors

FXLS8974CF

3-Axis Low-g Accelerometer

• Do not place any components or vias within 2 mm of the package land area as it may

cause additional package stress if placed too close to the package land area.

• Signal traces connected to pads should be as symmetric as possible. To have the

same length of exposed trace for all pads, put dummy traces on NC pads .

• Use a standard pick-and-place process and equipment. Do not use a hand soldering

process.

• Customers are advised to be cautious about the proximity of screw-down holes to the

sensor, and the location of any press fit to the assembled PCB when in an enclosure.

It is important that the assembled PCB remain flat after assembly to keep electronic

operation of the device optimal.

• The PCB should be rated for the multiple lead-free reflow condition with a maximum

260 °C temperature.

• NXP sensors are compliant with Restrictions on Hazardous Substances (RoHS),

having halide-free molding compound (green) and lead-free terminations. These

terminations are compatible with tin-lead (Sn-Pb) as well as tin-silver-copper (Sn-Ag-

Cu) solder paste soldering processes. Reflow profiles applicable to those processes

can be used successfully for soldering the devices.

10X 0.25

0.15

10X 0.45

0.35

10X 0.400 Min1

2X 0.050 Typ2

2X 0.0375 Typ2

10X 0.425 Min

0.450 Typ

10X 0.825 Min1

0.850 Typ

10X 1.0

Package outline

8X 0.4

10X 0.200 Min

0.225 Typ

Package

Solder mask

PCB land pad

Package outline

PCB land pad

[1] PCB pad lengths exterior to the package edge should be at

least 0.4 mm long. If board space allows, a longer pad extension,

such as 0.6 mm will generally result in more consistent fillet

formation. This is because the inspectable solder fillet formation

will be influenced less by PCB assembly issues, such as misalignment.

[2] The solder mask clearance should be designed to be greater

than or equal to PCB vendor's solder mask registration.

Solder mask

opening

aaa-028908

Figure 29. PCB footprint guidelines

FXLS8974CF

All information provided in this document is subject to legal disclaimers.

Objective data sheet

Rev. 1 — 27 April 2021

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