USB333X datasheet(74/85 Pages) MICROCHIP

74 / 85 page

USB333x

DS00001880A-page 74

 2009 - 2015 Microchip Technology Inc.

8.4.2

EN/IEC 61000-4-2 PERFORMANCE

The EN/IEC 61000-4-2 ESD specification is an international standard that addresses system-level immunity to ESD

strikes while the end equipment is operational. In contrast, the HBM ESD tests are performed at the device level with

the device powered down.

Microchip contracts with Independent laboratories to test the USB333x to EN/IEC 61000-4-2 in a working system.

Reports are available upon request. Please contact your Microchip representative, and request information on 3rd party

ESD test results. The reports show that systems designed with the USB333x can safely provide the ESD performance

shown in Table 4-13 without additional board level protection.

In addition to defining the ESD tests, EN/IEC 61000-4-2 also categorizes the impact to equipment operation when the

strike occurs (ESD Result Classification). The USB333x maintains an ESD Result Classification 1 or 2 when subjected

to an EN/IEC 61000-4-2 (level 4) ESD strike.

Both air discharge and contact discharge test techniques for applying stress conditions are defined by the EN/IEC

61000-4-2 ESD document.

8.4.2.1

Air Discharge

To perform this test, a charged electrode is moved close to the system being tested until a spark is generated. This test

is difficult to reproduce because the discharge is influenced by such factors as humidity, the speed of approach of the

electrode, and construction of the test equipment.

8.4.2.2

Contact Discharge

The uncharged electrode first contacts the USB connector to prepare this test, and then the probe tip is energized. This

yields more repeatable results, and is the preferred test method. The independent test laboratories contracted by Micro-

chip provide test results for both types of discharge methods.

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