IP4856CX25_C

All information provided in this document is subject to legal disclaimers.

© NXP Semiconductors N.V. 2014. All rights reserved.

Product data sheet

Rev. 2 — 15 October 2014

17 of 21

NXP Semiconductors

IP4856CX25/C

SD 3.0-compliant memory card integrated dual voltage level translator

16. Abbreviations

Table 17.

Reflow soldering process characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

230

-

260

C

time 1

soak time

60

-

180

s

time 2

time during T

 250 C

--30

s

time 3

time during T

 230 C10

-

50

s

time 4

time during T > 217

C

30

-

150

s

time 5

-

-

540

s

dT/dt

rate of change of

temperature

cooling rate

-

-

6

C/s

preheat

2.5

-

4.0

C/s

Table 18.

Abbreviations

Acronym

Description

DUT

Device Under Test

EMI

ElectroMagnetic Interference

ESD

ElectroStatic Discharge

FR4

Flame Retard 4

MMC

MultiMedia Card

NSMD

Non-Solder Mask PCB Design

OSP

Organic Solderability Preservation

PCB

Printed-Circuit Board

RoHS

Restriction of Hazardous Substances

SD

Secure Digital

WLCSP

Wafer-Level Chip-Scale Package