TPS65982ABZBHR datasheet(94/121 Pages) TI1

номер детали	TPS65982ABZBHR

подробное описание детали	USB Type-C and USB PD Controller, Power Switch, and High-Speed Multiplexer

PDF	121 Pages

Scroll/Zoom	100%

производитель	TI1 [Texas Instruments]

домашняя страница	http://www.ti.com

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TPS65982

SLVSD02D – MARCH 2015 – REVISED JUNE 2019

www.ti.com

Product Folder Links: TPS65982

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Layout Guidelines (continued)

Figure 87. Top View Standard TPS65982 Footprint (Circular Pads)

Figure 88. Under Ball Recommended Via Size

12.1.2 Alternate TPS65982 Footprint (Oval Pads)

Figure 89 shows the TPS65982 footprint using oval-shaped pads in specific locations. This allows the PCB

designer to route the inner perimeter balls through the top layer. The balls around the perimeter have their pads

in an oval shape with the exception of the corner balls. Figure 90 shows the sizing for the oval pads, 0.25 mm by

0.17 mm. All of the other non-oval shaped pads will have a 0.25 mm diameter. This footprint is recommended for

MDI (Medium Density) PCB designs that are generally less expensive to build. The void under the TPS65982

allows for vias to route the inner signals and connect to the GND and power planes. Figure 91 shows the

recommended minimum via size (8mil hole and 16 mil diameter). The recommended 8mil vias will be rated for

approximately 1.8 A of DC current and 1.5 mΩ of resistance with 1.3 nH of inductance. Some board

manufactures may offer 6mil hole and 12 mil diameter vias with a mechanical drill. This footprint is available for

download on the TPS65982 product folder.

TPS65982ABZBHR датащи(PDF) 94 Page - Texas Instruments