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PCF8813 датащи(PDF) 69 Page - NXP Semiconductors

номер детали PCF8813
подробное описание детали  (67 1) x 102 pixels matrix LCD driver
PDF  72 Pages
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производитель  PHILIPS [NXP Semiconductors]
домашняя страница  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

PCF8813 датащи(HTML) 69 Page - NXP Semiconductors

Back Button PCF8813 Datasheet HTML 64Page - NXP Semiconductors PCF8813 Datasheet HTML 65Page - NXP Semiconductors PCF8813 Datasheet HTML 66Page - NXP Semiconductors PCF8813 Datasheet HTML 67Page - NXP Semiconductors PCF8813 Datasheet HTML 68Page - NXP Semiconductors PCF8813 Datasheet HTML 69Page - NXP Semiconductors PCF8813 Datasheet HTML 70Page - NXP Semiconductors PCF8813 Datasheet HTML 71Page - NXP Semiconductors PCF8813 Datasheet HTML 72Page - NXP Semiconductors  
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2004 Mar 05
69
Philips Semiconductors
Product specification
(67 + 1)
× 102 pixels matrix LCD driver
PCF8813
21 TRAY INFORMATION
handbook, full pagewidth
1,1
x,1
1,2
1,y
x,y
x
y
F
D
B
H
A
C
G
E
MGW798
K
L
M
J
A
A
SECTION A-A
Fig.58 Tray details.
Table 29 Tray dimensions
DIMS
DESCRIPTION
VALUE
A
pocket pitch; x direction
14.66 mm
B
pocket pitch; y direction
3.76 mm
C
pocket width; x direction
10.95 mm
D
pocket width; y direction
1.95 mm
E
tray width; x direction
50.8 mm
F
tray width; y direction
50.8 mm
G
distance from cut corner to pocket
(1, 1) centre
10.74 mm
H
distance from cut corner to pocket
(1, 1) centre
4.72 mm
J
tray thickness
3.96 mm
K
tray cross section
1.78 mm
L
tray cross section
2.44 mm
M
pocket depth
0.89 mm
x
number of pockets in x direction
3
y
number of pockets in y direction
12
handbook, halfpage
MGW799
Fig.59 Tray alignment.
The orientation of the IC in a pocket is indicated by the
position of the IC type name on the die surface with
respect to the chamfer on the upper left corner of the tray.
Refer to the bonding pad location diagram for the
orientating and position of the type name on the die
surface.



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