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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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PCF8813 датащи(PDF) 64 Page - NXP Semiconductors |
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PCF8813 датащи(HTML) 64 Page - NXP Semiconductors |
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64 / 72 page  2004 Mar 05 64 Philips Semiconductors Product specification (67 + 1) × 102 pixels matrix LCD driver PCF8813 Table 27 Bonding pad locations All x and y coordinates are referenced to the centre of the chip; dummy bumps should never be connected to any electrical nodes; dimensions in µm; see Fig.55. SYMBOL PAD COORDINATES xy dummy 1 −5328 +814.5 dummy 2 −5328 −814.5 dummy 3 −5274 −814.5 dummy and alignment 4 −5175 −814.5 dummy 5 −5085 −814.5 dummy 6 −5031 −814.5 R15 7 −4869 −814.5 R14 8 −4815 −814.5 R13 9 −4761 −814.5 R12 10 −4707 −814.5 R11 11 −4653 −814.5 R10 12 −4599 −814.5 R9 13 −4545 −814.5 R8 14 −4491 −814.5 R7 15 −4437 −814.5 R6 16 −4383 −814.5 R5 17 −4329 −814.5 R4 18 −4275 −814.5 R3 19 −4221 −814.5 R2 20 −4167 −814.5 R1 21 −4113 −814.5 R0 22 −4059 −814.5 R16 23 −3843 −814.5 R17 24 −3789 −814.5 R18 25 −3735 −814.5 R19 26 −3681 −814.5 R20 27 −3627 −814.5 R21 28 −3573 −814.5 R22 29 −3519 −814.5 R23 30 −3465 −814.5 R24 31 −3411 −814.5 R25 32 −3357 −814.5 R26 33 −3303 −814.5 R27 34 −3249 −814.5 R28 35 −3195 −814.5 R29 36 −3141 −814.5 R30 37 −3087 −814.5 R31 38 −3033 −814.5 C0 39 −2871 −814.5 C1 40 −2817 −814.5 C2 41 −2763 −814.5 C3 42 −2709 −814.5 C4 43 −2655 −814.5 C5 44 −2601 −814.5 C6 45 −2547 −814.5 C7 46 −2493 −814.5 C8 47 −2439 −814.5 C9 48 −2385 −814.5 C10 49 −2331 −814.5 C11 50 −2277 −814.5 C12 51 −2223 −814.5 C13 52 −2169 −814.5 C14 53 −2115 −814.5 C15 54 −2061 −814.5 C16 55 −2007 −814.5 C17 56 −1953 −814.5 C18 57 −1899 −814.5 C19 58 −1845 −814.5 C20 59 −1791 −814.5 C21 60 −1737 −814.5 C22 61 −1683 −814.5 C23 62 −1629 −814.5 C24 63 −1575 −814.5 C25 64 −1521 −814.5 C26 65 −1467 −814.5 C27 66 −1413 −814.5 C28 67 −1359 −814.5 C29 68 −1305 −814.5 C30 69 −1251 −814.5 C31 70 −1197 −814.5 C32 71 −1035 −814.5 C33 72 −981 −814.5 C34 73 −927 −814.5 C35 74 −873 −814.5 SYMBOL PAD COORDINATES xy |
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