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STM32F410RB датащи(PDF) 55 Page - STMicroelectronics |
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STM32F410RB датащи(HTML) 55 Page - STMicroelectronics |
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55 / 142 page ![]() DocID028094 Rev 5 55/142 STM32F410x8/B Electrical characteristics 118 Table 16. Features depending on the operating power supply range Operating power supply range ADC operation Maximum Flash memory access frequency with no wait states (fFlashmax) Maximum Flash memory access frequency with wait states (1)(2) I/O operation Clock output frequency on I/O pins(3) Possible Flash memory operations VDD =1.7 to 2.1 V(4) Conversion time up to 1.2 Msps 16 MHz(5) 100 MHz with 6 wait states – No I/O compensation up to 30 MHz 8-bit erase and program operations only VDD = 2.1 to 2.4 V Conversion time up to 1.2 Msps 18 MHz 100 MHz with 5 wait states – No I/O compensation up to 30 MHz 16-bit erase and program operations VDD = 2.4 to 2.7 V Conversion time up to 2.4 Msps 24 MHz 100 MHz with 4 wait states –I/O compensation works up to 50 MHz 16-bit erase and program operations VDD = 2.7 to 3.6 V Conversion time up to 2.4 Msps 30 MHz 100 MHz with 3 wait states –I/O compensation works –up to 100 MHz when VDD = 3.0 to 3.6 V –up to 50 MHz when VDD = 2.7 to 3.0 V 32-bit erase and program operations 1. Applicable only when the code is executed from Flash memory. When the code is executed from RAM, no wait state is required. 2. Thanks to the ART accelerator and the 128-bit Flash memory, the number of wait states given here does not impact the execution speed from Flash memory since the ART accelerator allows to achieve a performance equivalent to 0 wait state program execution. 3. Refer to Table 57: I/O AC characteristics for frequencies vs. external load. 4. VDD/VDDA minimum value of 1.7 V, with the use of an external power supply supervisor (refer to Section 3.15.2: Internal reset OFF). 5. Prefetch is not available. Refer to AN3430 application note for details on how to adjust performance and power. |
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