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L6751 датащи(PDF) 42 Page - STMicroelectronics

номер детали L6751
подробное описание детали  Digitally controlled dual PWM for Intel VR12 and AMD SVI
PDF  59 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
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L6751 датащи(HTML) 42 Page - STMicroelectronics

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Single NTC thermal monitor and compensation
L6751
42/59
Doc ID 023992 Rev 1
increases. Un-compensated systems show temperature dependencies on the regulated
voltage, overcurrent protection and current reporting.
The temperature information available on the TM/STM pin and used for thermal monitoring
may be used also for this purpose. By comparing the voltage on the TM/STM pin with the
voltage present on the TCOMP/STCOMP pin, the L6751 corrects the IDROOP/ISDROOP
current used for voltage positioning (see Section 6.3), so recovering the DCR temperature
deviation. Depending on NTC location and distance from the inductors and the available
airflow, the correlation between NTC temperature and DCR temperature may be different:
TCOMP/STCOMP adjustments allow the gain between the sensed temperature and the
correction made on the IDROOP/ISDROOP current to be modified.
Short TCOMP/STCOMP to GND to disable thermal compensation (no correction of
IDROOP/ISDROOP is made).
8.3
TM/STM and TCOMP/STCOMP design
This procedure applies to both single-phase and multi-phase sections.
1.
Properly choose the resistive network to be connected to the TM pin. Recommended
values/network is reported in Figure 11.
2.
Connect voltage generator to the TCOMP pin (default value 3.3 V).
3.
Power on the converter and load the thermal design current (TDC) with the desired
cooling conditions. Record the output voltage regulated as soon as the load is applied.
4.
Wait for thermal steady-state. Adjust down the voltage generator on the TCOMP pin in
order to get the same output voltage recorded at point #3.
5.
Design the voltage divider connected to TCOMP (between VCC5 and GND) in order to
get the same voltage set to TCOMP at point #4.
6.
Repeat the test with the TCOMP divider designed at point #5 and verify the thermal
drift is acceptable. In the case of positive drift (i.e. output voltage at thermal steady-
state is bigger than output voltage immediately after loading TDC current), change the
divider at the TCOMP pin in order to reduce the TCOMP voltage. In the case of
negative drift (i.e. output voltage at thermal steady-state is smaller than output voltage
immediately after loading TDC current), change the divider at the TCOMP pin in order
to increase the TCOMP voltage.
7.
The same procedure can be implemented with a variable resistor in place of one of the
resistors of the divider. In this case, once the compensated configuration is found,
simply replace the variable resistor with a resistor with the same value.



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