AD1981B

Rev. C | Page 32 of 32

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MS-026BBC

TOP VIEW

(PINS DOWN)

1

12

13

25

24

36

37

48

0.27

0.22

0.17

0.50

BSC

LEAD PITCH

7.00

BSC SQ

1.60

MAX

0.75

0.60

0.45

VIEW A

9.00 BSC

SQ

PIN 1

0.20

0.09

1.45

1.40

1.35

0.08 MAX

COPLANARITY

VIEW A

ROTATED 90° CCW

SEATING

PLANE

7°

3.5°

0°

0.15

0.05

Figure 10. 48-Lead Low Profile Quad Flat Package [LQFP]

(ST-48)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

AD1981BJST

0°C to 70°C

48-Lead LQFP

ST-48

AD1981BJST-REEL

0°C to 70°C

48-Lead LQFP

ST-48

AD1981BJSTZ1

0°C to 70°C

48-Lead LQFP

ST-48

AD1981BJSTZ-REEL1

0°C to 70°C

48-Lead LQFP

ST-48

AD1981BBSTZ1, 2

−40°C to +85°C

48-Lead LQFP

ST-48

AD1981BBSTZ-REEL1, 2

−40°C to +85°C

48-Lead LQFP

ST-48

on the leads of each device is 100% pure tin electroplate. The device is suitable for lead-free applications and can withstand surface-mount soldering at up to 255°C

(±5°C). In addition, it is backward compatible with conventional tin-lead soldering processes. This means that the electroplated tin coating can be soldered with tin-

lead solder pastes at reflow temperatures of 220°C to 235°C.

© 2005 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

C03091–0–1/05(C)