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MPC8306EC датащи(PDF) 50 Page - Freescale Semiconductor, Inc |
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MPC8306EC датащи(HTML) 50 Page - Freescale Semiconductor, Inc |
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50 / 76 page ![]() MPC8306 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 0 50 Freescale Semiconductor Package and Pin Listings 21 Package and Pin Listings This section details package parameters, pin assignments, and dimensions. The MPC8306 is available in a thermally enhanced MAPBGA (mold array process-ball grid array); see Section 21.1, “Package Parameters for the MPC8306,” and Section 21.2, “Mechanical Dimensions of the MPC8306 MAPBGA,” for information on the MAPBGA. 21.1 Package Parameters for the MPC8306 The package parameters are as provided in the following list. Package outline 19 mm 19 mm Package Type MAPBGA Interconnects 369 Pitch 0.80 mm Module height (typical) 1.48 mm; Min = 1.31mm and Max 1.61mm Solder Balls 96 Sn / 3.5 Ag / 0.5 Cu (VM package) Ball diameter (typical) 0.40 mm 21.2 Mechanical Dimensions of the MPC8306 MAPBGA Figure below shows the mechanical dimensions and bottom surface nomenclature of the MPC8306, 369-MAPBGA package. |
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