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MPC8306EC датащи(PDF) 37 Page - Freescale Semiconductor, Inc |
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MPC8306EC датащи(HTML) 37 Page - Freescale Semiconductor, Inc |
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37 / 76 page ![]() MPC8306 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 0 Freescale Semiconductor 37 eSDHC 13 eSDHC This section describes the DC and AC electrical specifications for the eSDHC interface of the device. 13.1 eSDHC DC Electrical Characteristics Table 36 provides the DC electrical characteristics for the eSDHC interface. 13.2 eSDHC AC Timing Specifications Table 37 provides the eSDHC AC timing specifications as defined in Figure 27 and Figure 28. Table 36. eSDHC Interface DC Electrical Characteristics At recommended operating conditions with OVDD =3.3 V Characteristic Symbol Condition Min Max Unit Notes Input high voltage VIH —0.625 OVDD —V 1 Input low voltage VIL — — 0.25 OVDD V1 Output high voltage VOH IOH = –100 A at OVDD min 0.75 OVDD —V — Output low voltage VOL IOL =100 A at OVDD min —0.125 OVDD V— Output high voltage VOH IOH = –100 mA OVDD –0.2 — V 2 Output low voltage VOL IOL =2mA — 0.3 V 2 Input/output leakage current IIN/IOZ —–10 10 A— Note: 1. Note that the min VILand max VIH values are based on the respective min and max OVIN values found in Table 2.. 2. Open drain mode for MMC cards only. Table 37. eSDHC AC Timing Specifications At recommended operating conditions with OVDD =3.3 V Parameter Symbol1 Min Max Unit Notes SD_CLK clock frequency: SD/SDIO Full-speed/High-speed mode MMC Full-speed/High-speed mode fSHSCK 0 25/33.25 20/52 MHz 2, 4 SD_CLK clock low time—Full-speed/High-speed mode tSHSCKL 10/7 — ns 4 SD_CLK clock high time—Full-speed/High-speed mode tSHSCKH 10/7 — ns 4 SD_CLK clock rise and fall times tSHSCKR/ tSHSCKF —3 ns 4 Input setup times: SD_CMD, SD_DATx, SD_CD to SD_CLK tSHSIVKH 5— ns 4 |
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