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Boxed Processor Specifications

7.3

Thermal Specifications

This section describes the cooling requirements of the fan heatsink solution utilized by

the boxed processor.

7.3.1

Boxed Processor Cooling Requirements

The boxed processor may be directly cooled with a fan heatsink. However, meeting the

processor's temperature specification is also a function of the thermal design of the

entire system, and ultimately the responsibility of the system integrator. The processor

temperature specification is in Chapter 5. The boxed processor fan heatsink is able to

keep the processor temperature within the specifications (see Table 26) in chassis that

provide good thermal management. For the boxed processor fan heatsink to operate

properly, it is critical that the airflow provided to the fan heatsink is unimpeded. Airflow

of the fan heatsink is into the center and out of the sides of the fan heatsink. Airspace

is required around the fan to ensure that the airflow through the fan heatsink is not

blocked. Blocking the airflow to the fan heatsink reduces the cooling efficiency and

decreases fan life. Figure 22 and Figure 23 illustrate an acceptable airspace clearance

for the fan heatsink. The air temperature entering the fan should be kept below 38 °C.

A Thermally Advantaged Chassis with an Air Guide 1.1 is recommended to meet the 38

°C requirement. Again, meeting the processor's temperature specification is the

responsibility of the system integrator.

Note:

The processor fan is the primary source of airflow for cooling the VCC voltage regulator.

Dedicated voltage regulator cooling components may be necessary if the selected fan is

not capable of keeping regulator components below maximum rated temperatures.

Figure 21.

Baseboard Power Header Placement Relative to Processor Socket

R110

[4.33]

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