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352 датащи(PDF) 90 Page - Intel Corporation |
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352 датащи(HTML) 90 Page - Intel Corporation |
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90 / 95 page ![]() Boxed Processor Specifications 90 Datasheet Clearance is required around the fan heatsink to ensure unimpeded airflow for proper cooling. The physical space requirements and dimensions for the boxed processor with assembled fan heatsink are shown in Figure 17 (Side View), and Figure 18 (Top View). The airspace requirements for the boxed processor fan heatsink must also be incorporated into new baseboard and system designs. Airspace requirements are shown in Figure 22 and Figure 23. Note that some figures have centerlines shown (marked with alphabetic designations) to clarify relative dimensioning. NOTES: 1. The boxed Celeron D processor in the 775-land package cooling solution with clip is currently under development and, at this time, is preliminary. The diagrams shown may not reflect the final product. 2. Diagram does not show the attached hardware for the clip design and is provided only as a mechanical representation. Figure 17. Space Requirements for the Boxed Processor (Side View: applies to all four side views) Figure 18. Space Requirements for the Boxed Processor (Top View) 95.0 [3.74] 10.0 [0.39] 25.0 [0.98] 81.3 [3.2] 95.0 [3.74] 95.0 [3.74] |
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