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Thermal Specifications and Design Considerations

5.2.3

PROCHOT# Signal

An external signal, PROCHOT# (processor hot), is asserted when the processor die

temperature has reached its maximum operating temperature. If the Thermal Monitor

is enabled (note that the Thermal Monitor must be enabled for the processor to be

operating within specification), the TCC will be active when PROCHOT# is asserted. The

processor can be configured to generate an interrupt upon the assertion or de-

assertion of PROCHOT#. Refer to the Intel Architecture Software Developer's Manuals

for specific register and programming details.

The Celeron D processor implements a bi-directional PROCHOT# capability to allow

system designs to protect various components from over-temperature situations. The

PROCHOT# signal is bi-directional in that it can either signal when the processor has

reached its maximum operating temperature or be driven from an external source to

activate the TCC. The ability to activate the TCC via PROCHOT# can provide a means

for thermal protection of system components.

One application is the thermal protection of voltage regulators (VR). System designers

can create a circuit to monitor the VR temperature and activate the TCC when the

temperature limit of the VR is reached. By asserting PROCHOT# (pulled-low) and

activating the TCC, the VR can cool down as a result of reduced processor power

consumption. Bi-directional PROCHOT# can allow VR thermal designs to target

maximum sustained current instead of maximum current. Systems should still provide

proper cooling for the VR, and rely on bi-directional PROCHOT# only as a backup in

case of system cooling failure. Refer to the Voltage Regulator-Down (VRD) 10.1 Design

Guide For Desktop and Transportable LGA775 Socket for details on implementing the

bi-directional PROCHOT# feature.

5.2.4

THERMTRIP# Signal

Regardless of whether or not Thermal Monitor is enabled, in the event of a catastrophic

cooling failure, the processor will automatically shut down when the silicon has reached

an elevated temperature (refer to the THERMTRIP# definition in Table 25). At this

point, the FSB signal THERMTRIP# will go active and stay active as described in

Table 25. THERMTRIP# activation is independent of processor activity and does not

generate any bus cycles.

5.2.5

TCONTROL and Fan Speed Reduction

TCONTROL is a temperature specification based on a temperature reading from the

thermal diode. The value for TCONTROL will be calibrated in manufacturing and

configured for each processor. When TDIODE is above TCONTROL then TC must be at or

below TC_MAX as defined by the thermal profile in Table 28; otherwise, the processor

temperature can be maintained at TCONTROL (or lower) as measured by the thermal

diode.

The purpose of this feature is to support acoustic optimization through fan speed

control. Contact your field representative for further details.

5.2.6

Thermal Diode

The processor incorporates an on-die PNP transistor whose base emitter junction is

used as a thermal "diode", with its collector shorted to Ground. A thermal sensor

located on the system board may monitor the die temperature of the processor for

thermal management and fan speed control. Table 30, Table 31, Table 32, and Table 33

provide the "diode" parameter and interface specifications. Two different sets of "diode"

parameters are listed in Table 30 and 31. The Diode Model parameters (Table 30) apply

to traditional thermal sensors that use the Diode Equation to determine the processor

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