AD9553SLASHPCBZ datasheet(28/44 Pages) AD

28 / 44 page

AD9553

Rev. 0 | Page 28 of 44

APPLICATIONS INFORMATION

THERMAL PERFORMANCE

The AD9553 is specified for a case temperature (TCASE). To

ensure that TCASE is not exceeded, an airflow source can be used.

Use the following equation to determine the junction tempera-

ture on the application PCB:

TJ = TCASE + (ΨJT × PD)

where:

TJ is the junction temperature (°C).

TCASE is the case temperature (°C) measured by the customer

at the top center of the package.

ΨJT is the value indicated in Table 23.

PD is the power dissipation (see the Power Consumption

section).

Values of θJA are provided for package comparison and PCB design

considerations. θJA can be used for a first-order approximation

of TJ using the following equation:

TJ = TA + (θJA × PD)

where TA is the ambient temperature (°C).

Values of θJC are provided for package comparison and PCB

design considerations when an external heat sink is required.

Values of θJB are provided for package comparison and PCB

design considerations.

Table 23. Thermal Parameters for the 32-Lead LFCSP Package

Symbol

Description

Value1

Unit

θJA

Junction-to-ambient thermal resistance, 0 m/sec airflow per JEDEC JESD51-2 (still air)

41.6

°C/W

θJMA

Junction-to-ambient thermal resistance, 1.0 m/sec airflow per JEDEC JESD51-6 (moving air)

36.4

°C/W

θJMA

Junction-to-ambient thermal resistance, 2.5 m/sec airflow per JEDEC JESD51-6 (moving air)

32.6

°C/W

θJB

Junction-to-board thermal resistance, 0 m/sec airflow per JEDEC JESD51-8 (still air)

24.2

°C/W

ΨJB

Junction-to-board characterization parameter, 0 m/sec airflow per JEDEC JESD51-6 (still air)

22.9

°C/W

θJC

Junction-to-case thermal resistance

4.8

°C/W

ΨJT

Junction-to-top-of-package characterization parameter, 0 m/sec airflow per JEDEC JESD51-2 (still air)

0.5

°C/W

1 Results are from simulations. The PCB is a JEDEC multilayer type. Thermal performance for actual applications requires careful inspection of the conditions in the

application to determine whether they are similar to those assumed in these calculations.

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