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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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AD9992BBCZ датащи(PDF) 92 Page - Analog Devices |
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AD9992BBCZ датащи(HTML) 92 Page - Analog Devices |
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92 / 92 page  AD9992 Rev. C | Page 92 of 92 OUTLINE DIMENSIONS *COMPLIANT TO JEDEC STANDARDS MO-225 WITH THE EXCEPTION TO PACKAGE HEIGHT. A1 BALL CORNER TOP VIEW BALL A1 PAD CORNER DETAIL A BOTTOM VIEW 8.10 8.00 SQ 7.90 SEATING PLANE BALL DIAMETER 0.25 MIN 0.45 0.40 0.35 COPLANARITY 0.10 0.91 MIN 0.65 BSC 6.50 BSC SQ DETAIL A *1.40 1.31 1.16 10 11 8 7 6 3 21 9 5 4 A B C D E F G J H K L Figure 88. 105-Lead Chip Scale Package Ball Grid Array [CSP_BGA] 8 mm × 8 mm Body (BC-105-1) Dimensions shown in millimeters ORDERING GUIDE Model Temperature Range Package Description Package Option AD9992BBCZ1 –25°C to +85°C 105-Lead CSP_BGA BC-105-1 AD9992BBCZRL1 –25°C to +85°C 105-Lead CSP_BGA BC-105-1 1 Z = RoHS Compliant Part. ©2006–2007 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D05891-0-10/07(C) |
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