7547 datasheet(3/91 Pages) RENESAS

3 / 91 page

Rev.1.21

Nov 15, 2006

page 3 of 89

REJ03B0156-0121

7547 Group

Table 1 Performance overview

Parameter

0.25

µs

(Minimum instruction, oscillation frequency 8 MHz: double-speed mode)

8 MHz (max.)

8 K to 16 K bytes

384 to 512 bytes

•8-bit ✕ 3, 5-bit ✕ 1

18 sources, 16 vectors

•8-bit ✕ 2, 16-bit ✕ 2

4 channel

2 channel

8-bit ✕ 2 (UART or clock synchronous)

10-bit ✕ 8 channel

16-bit ✕ 1

Built-in

(external ceramic resonator or quartz-crystal oscillator, RC oscillation available)

(Low consumption current by on-chip oscillator available)

4.5 to 5.5 V

4.0 to 5.5 V

2.4 to 5.5 V

2.2 to 5.5 V

4.0 to 5.5 V

2.4 to 5.5 V

2.2 to 5.5 V

4.0 to 5.5 V

2.4 to 5.5 V

2.2 to 5.5 V

1.8 to 5.5 V

29.5 mW (Typ.)

-20 to 85 °C

CMOS sillicon gate

36-pin plastic molded SSOP

Number of basic instructions

Instruction execution time

Oscillation frequency

Memory sizes

ROM

RAM

I/O port

P0, P1, P2, P3

Interrupts

Timer

Output compare

Input capture

Serial interface

A/D converter

Watchdog timer

Clock generating circuit

Power source

Double-speed mode

At 8MHz oscillation

voltage

At 6.5MHz oscillation

(at ceramic

At 2MHz oscillation

resonance)

At 1MHz oscillation

High-speed mode

At 8MHz oscillation

Middle-speed mode

At 4MHz oscillation

At 2MHz oscillation

Power source

High-speed mode

At 4MHz oscillation

voltage

Middle-speed mode

At 2MHz oscillation

(at RC oscillation)

At 1MHz oscillation

Power source voltage (at on-chip oscillation)

Power dissipation

Operating temperature range

Device structure

Package

Function

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