4-Port PoE Manager

Microsemi Proprietary and Confidential. PD69104B1/F Datasheet Revision 2.0

23

Thermal resistance-junction to case is 4 °C/W.

Note: All of the above assume no ambient airflow. Junction temperature calculation: T = T + (P × θ ).

J

A

D

JA

The θ numbers are guidelines for the thermal performance of the device/PC-board system.

JA

6.3

RoHS and Solder Reflow Information

The following lists the recommended RoHS and solder reflow information for the PD69104B1/F device.

RoHS 6/6

Pb-free 100% matte tin finish

Package peak temperature for solder reflow (40 seconds maximum exposure)—260 °C

(0 ° C, –5 °C)

Note: Exceeding these ratings can cause damage to the device.

The following table lists the reflow profiles.

Table 19 • Classification Reflow Profiles

Profile Feature

Pb-Free Assembly

Average ramp-up rate (TS

to Tp)

max

3 °C/second max

Preheat

Temperature min (TS )

min

Temperature max (TS

)

max

Time (ts

to ts

)

min

max

150 °C

200 °C

60–180 seconds

Time maintained

Temperature (T )

L

Time (t )

L

217 °C

60–150 seconds

Peak classification temperature (T )

P

240 - 255 °C

Time within 5 °C of actual peak temperature (tp)

20–40 seconds

Ramp-down rate

6 °C/second max

Time 25 °C to peak temperature

8 minutes max

Note: All temperatures refer to topside of the package, measured on the package body surface.

The following illustration shows the classification reflow profiles.