Ambient Temperature (qC)

0

10

20

30

40

50

60

70

80

90

100

0

5

10

15

20

25

30

35

D003

400 LFM

200 LFM

100 LFM

Nat. conv.

Board Temperature (qC)

0

20

40

60

80

100

120

140

0

5

10

15

20

25

30

35

D004

Min

Typ

TC - Junction Temperature (qC)

-50

-25

0

25

50

75

100

125

150

0.6

0.65

0.7

0.75

0.8

0.85

0.9

0.95

1

1.05

D002

Output Current (A)

3

6

9

12

15

18

21

24

27

30

0

2

4

6

8

10

12

D001

Typ

Max

CSD97396Q4M

SLPS572 – DECEMBER 2015

www.ti.com

Typical Application (continued)

8.2.1 Application Curves

TJ = 125°C, unless stated otherwise. The Typical CSD97396Q4M System Characteristic curves (see Figure 6 and Figure 7)

are based on measurements made on a PCB design with dimensions of 4.0" (W) × 3.5" (L) × 0.062" (T) and 6 copper layers

of 1 oz. copper thickness. See System Example for detailed explanation.

VIN = 12 V

VDD = 5 V

VOUT = 1.8 V

VIN = 12 V

VDD = 5 V

VOUT = 1.8 V

ƒSW = 500 kHz

LOUT = 0.29 µH

ƒSW = 500 kHz

LOUT = 0.29 µH

Figure 4. Power Loss vs Output Current

Figure 5. Power Loss vs Temperature

VIN = 12 V

VDD = 5 V

VOUT = 1.8 V

VIN = 12 V

VDD = 5 V

VOUT = 1.8 V

ƒSW = 500 kHz

LOUT = 0.29 µH

ƒSW = 500 kHz

LOUT = 0.29 µH

Figure 7. Typical Safe Operating Area

Figure 6. Safe Operating Area – PCB Horizontal Mount

10

Submit Documentation Feedback

Copyright © 2015, Texas Instruments Incorporated