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MCF5373CAB180 датащи(PDF) 10 Page - Freescale Semiconductor, Inc |
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MCF5373CAB180 датащи(HTML) 10 Page - Freescale Semiconductor, Inc |
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10 / 42 page ![]() MCF5373 ColdFire® Microprocessor Data Sheet, Rev. 0.3 Preliminary Mechanicals and Pinouts Freescale Semiconductor 10 4.2 Package Dimensions—196 MAPBGA Figure 2 shows the MCF5373LCVM240 and MCF5372LCVM240 package dimensions. Figure 2. 196 MAPBGA Package Dimensions (Case No. 1128A-01) X 0.20 Laser mark for pin 1 identification in this area e 13X D E M S A1 A2 A 0.15 Z 0.30 Z Z Rotated 90 Clockwise Detail K ° 5 View M-M e 13X S M X 0.30 Y Z 0.10 Z 3 b 196X Metalized mark for pin 1 identification in this area 14 13 12 11 5 4 3 2 B C D E F G H J K L 4 NOTES: 1. Dimensions are in millimeters. 2. Interpret dimensions and tolerances per ASME Y14.5M, 1994. 3. Dimension B is measured at the maximum solder ball diameter, parallel to datum plane Z. 4. Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5. Parallelism measurement shall exclude any effect of mark on top surface of package. DIM Min Max Millimeters A 1.32 1.75 A1 0.27 0.47 A2 1.18 REF b 0.35 0.65 D 15.00 BSC E 15.00 BSC e 1.00 BSC S 0.50 BSC Y K M N P A 1 6 10 9 Top View Bottom View |
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