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MCF5373CAB180 датащи(PDF) 27 Page - Freescale Semiconductor, Inc |
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MCF5373CAB180 датащи(HTML) 27 Page - Freescale Semiconductor, Inc |
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27 / 42 page ![]() Preliminary Electrical Characteristics MCF5373 ColdFire® Microprocessor Data Sheet, Rev. 0.3 Preliminary Freescale Semiconductor 27 5.8.2 DDR SDRAM AC Timing Characteristics When using the SDRAM controller in DDR mode, the following timing numbers must be followed to properly latch or drive data onto the memory bus. All timing numbers are relative to the four DQS byte lanes. The following timing numbers are subject to change at anytime, and are only provided to aid in early board design. Please contact your local Freescale representative if questions develop. Table 12. DDR Timing Specifications Num Characteristic Symbol Min Max Unit Notes Frequency of Operation tDDCK 80 TBD Mhz 1 NOTES: 1 The frequency of operation is either 2x or 4x the FB_CLK frequency of operation. FlexBus and SDRAM clock operate at the same frequency as the internal bus clock. DD1 Clock Period tDDSK TBD 12.5 ns 2 2 SD_CLK is one SDRAM clock in (ns). DD2 Pulse Width High tDDCKH 0.45 0.55 SD_CLK 3 3 Pulse width high plus pulse width low cannot exceed min and max clock period. DD3 Pulse Width Low tDDCKL 0.45 0.55 SD_CLK 3 DD4 Address, SD_CKE, SD_CAS, SD_RAS, SD_WE, SD_CS[1:0] - Output Valid tSDCHACV —0.5 × SD_CLK +1.0 ns 4 4 Command output valid should be 1/2 the memory bus clock (SD_CLK) plus some minor adjustments for process, temperature, and voltage variations. DD5 Address, SD_CKE, SD_CAS, SD_RAS, SD_WE, SD_CS[1:0] - Output Hold tSDCHACI 2.0 — ns DD6 Write Command to first DQS Latching Transition tCMDVDQ — 1.25 SD_CLK DD7 Data and Data Mask Output Setup (DQ-->DQS) Relative to DQS (DDR Write Mode) tDQDMV 1.5 — ns 5 6 5 This specification relates to the required input setup time of today’s DDR memories. Rigoletto’s output setup should be larger than the input setup of the DDR memories. If it is not larger, then the input setup on the memory will be in violation. MEM_DATA[31:24] is relative to MEM_DQS[3], MEM_DATA[23:16] is relative to MEM_DQS[2], MEM_DATA[15:8] is relative to MEM_DQS[1], and MEM_[7:0] is relative MEM_DQS[0]. 6 The first data beat will be valid before the first rising edge of DQS and after the DQS write preamble. The remaining data beats will be valid for each subsequent DQS edge. DD8 Data and Data Mask Output Hold (DQS-->DQ) Relative to DQS (DDR Write Mode) tDQDMI 1.0 — ns 7 7 This specification relates to the required hold time of today’s DDR memories. MEM_DATA[31:24] is relative to MEM_DQS[3], MEM_DATA[23:16] is relative to MEM_DQS[2], MEM_DATA[15:8] is relative to MEM_DQS[1], and MEM_[7:0] is relative MEM_DQS[0]. DD9 Input Data Skew Relative to DQS (Input Setup) tDVDQ —1 ns 8 DD10 Input Data Hold Relative to DQS. tDIDQ 0.25 × SD_CLK +0.5ns —ns 9 DD11 DQS falling edge from SDCLK rising (output hold time) tDQLSDCH 0.5 — ns DD12 DQS input read preamble width tDQRPRE 0.9 1.1 SD_CLK DD13 DQS input read postamble width tDQRPST 0.4 0.6 SD_CLK DD14 DQS output write preamble width tDQWPRE 0.25 SD_CLK DD15 DQS output write postamble width tDQWPST 0.4 0.6 SD_CLK |
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