 |
поискавой системы для электроныых деталей |
|
|
поискавой системы для электроныых деталей |
|
ISL98607 датащи(PDF) 27 Page - Renesas Technology Corp |
|
|
|||||||||||||||||||||||||||||
ISL98607 датащи(HTML) 27 Page - Renesas Technology Corp |
|
|
27 / 29 page  ISL98607 7. Package Outline Drawings FN8421 Rev.1.00 Page 27 of 29 Jun.3.19 7. Package Outline Drawings W4x5.20E 20 Ball Wafer Level Chip Scale Package (WLCSP) (BSC) Rev 1, 1/13 NOTES: Dimensions and tolerance per ASME Y 14.5M - 1994. Dimension is measured at the maximum bump diameter parallel to primary datum Z . Primary datum Z and seating plane are defined by the spherical crowns of the bump. Bump position designation per JESD 95-1, SPP-010. There shall be a minimum clearance of 0.10mm between the edge of the bump and the body edge. 3. 2. 4. 1. 5. BOTTOM VIEW TOP VIEW SIDE VIEW RECOMMENDED LAND PATTERN PIN 1 PACKAGE 0.400 0.05 Z 0.265±0.035 0.200±0.030 0.540±0.050 (4X) Y 1.200 0.400 1.600 20x 0.265±0.035 12 3 4 0.200 A B C D E 3 SEATING PLANE Z 1.82±0.030 (A1 CORNER) 2.15±0.030 0.310 0.275 0.240 0.290 0.10 OUTLINE 0.10 Z X Y 0.05 Z 0.040 BSC (BACK IDE COATING) For the most recent package outline drawing, see W4x5.20E. |
|
ссылки URL |
| Вашему бизинису помогли Аллдатащит? [ DONATE ] |
Что такое Аллдатащит | реклама | контакт | Конфиденциальность | Ссылка на техническое описание | обмен ссыками | поиск по производителю All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
Russian ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
