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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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ST7LUS5 датащи(PDF) 113 Page - STMicroelectronics |
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ST7LUS5 датащи(HTML) 113 Page - STMicroelectronics |
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113 / 124 page  ST7LUS5, ST7LU05, ST7LU09 Package characteristics 113/124 13.2 Soldering information In accordance with the RoHS European directive, all STMicroelectronics packages have been converted to lead-free technology, named ECOPACK®. ● ECOPACK® packages are qualified according to the JEDEC STD-020C compliant soldering profile. ● Detailed information on the STMicroelectronics ECOPACK® transition program is available on www.st.com/stonline/leadfree/, with specific technical application notes covering the main technical aspects related to lead-free conversion (AN2033, AN2034, AN2035, AN2036). 13.2.1 Forward compatibility ECOPACK® SO packages are fully compatible with lead (Pb) containing soldering process (see application note AN2034). Table 86. Soldering compatibility (wave and reflow soldering process) Package Plating material Pb solder paste Pb-free solder paste SO NiPdAu (nickel-palladium-gold) Yes Yes |
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