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ST7LUS5 датащи(PDF) 112 Page - STMicroelectronics |
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ST7LUS5 датащи(HTML) 112 Page - STMicroelectronics |
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112 / 124 page ![]() Package characteristics ST7LUS5, ST7LU05, ST7LU09 112/124 13 Package characteristics In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK® is an ST trademark. ECOPACK® specifications are available at: www.st.com. 13.1 Package mechanical data Figure 60. 8-pin plastic small outline package, 150-mil width D B A1 A h x 45° A2 H E e L C α Dim. mm inches(1) 1. Values in inches are converted from mm and rounded to 3 decimal digits. Min Typ Max Min Typ Max A 1.35 1.75 0.053 0.069 A1 0.10 0.25 0.004 0.010 A2 1.10 1.65 0.043 0.065 B 0.33 0.51 0.013 0.020 C 0.19 0.25 0.007 0.010 D 4.80 5.00 0.189 0.197 E 3.80 4.00 0.150 0.158 e 1.27 0.050 H 5.80 6.20 0.228 0.244 h 0.25 0.50 0.010 0.020 α 0d 8d L 0.40 1.27 0.016 0.050 Number of pins N 8 Table 85. Thermal characteristics Symbol Ratings Package Value Unit RthJA Package thermal resistance (junction to ambient) SO8 130 °C/W TJmax Maximum junction temperature(1) 150 °C PDmax Power dissipation(2) 180 mW 1. The maximum chip-junction temperature is based on technology characteristics. 2. The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA. The power dissipation of an application can be defined by the user with the formula: PD =PINT +PPORT where PINT is the chip internal power (IDD x VDD) and PPORT is the port power dissipation depending on the ports used in the application. |
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