GRM0332C2A6R9DA01 datasheet(87/89 Pages) MURATA1

87 / 89 page

C02E.pdf

Nov.27,2017

Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

288

Notice

2. Adhesive Application

If you want to temporarily attach the capacitor to the board

using an adhesive agent before soldering the capacitor, ﬁrst

be sure that the conditions are appropriate for axing the

capacitor. If the dimensions of the land, the type of

adhesive, the amount of coating, the contact surface area,

the curing temperature, or other conditions are

inappropriate, the characteristics of the capacitor may

deteriorate.

1. Selection of Adhesive

1-1. Depending on the type of adhesive, there may be a

decrease in insulation resistance. In addition, there is a

chance that the capacitor might crack from contractile

stress due to the dierence in the contraction rate of

the capacitor and the adhesive.

1-2. If there is not enough adhesive, the contact surface

area is too small, or the curing temperature or curing

time are inadequate, the adhesive strength will be

insucient and the capacitor may loosen or become

disconnected during transportation or soldering.

If there is too much adhesive, for example if it overﬂows

onto the land, the result could be soldering defects, loss

of electrical connection, insucient curing, or slippage

aer the capacitor is mounted.

Furthermore, if the curing temperature is too high or the

curing time is too long, not only will the adhesive

strength be reduced, but solderability may also suer

due to the eects of oxidation on the terminations

(outer electrodes) of the capacitor and the land surface

on the board.

(1) Selection of Adhesive

Epoxy resins are a typical class of adhesive.

To select the proper adhesive, consider the following

points.

1) There must be enough adhesive strength to

prevent the component from loosening or slipping

during the mounting process.

2) The adhesive strength must not decrease when

exposed to moisture during soldering.

3) The adhesive must have good coatability and

shape retention properties.

4) The adhesive must have a long pot life.

5) The curing time must be short.

6) The adhesive must not be corrosive to the exterior

of the capacitor or the board.

7) The adhesive must have good insulation properties.

8) The adhesive must not emit toxic gases or

otherwise be harmful to health.

9) The adhesive must be free of halogenated

compounds.

3. Board Design

When designing the board, keep in mind that the amount

of strain which occurs will increase depending on the size

and material of the board.

[Relationship with amount of strain to the board

thickness, length, width, etc.]

= 3PL

Ewh2

Relationship between load and strain

When the load is constant, the following relationship can be established.

· As the distance between the supporting points (L) increases,

the amount of strain also increases.

→Reduce the distance between the supporting points.

· As the elastic modulus (

E) decreases, the amount of strain increases.

→Increase the elastic modulus.

· As the board width (

w) decreases, the amount of strain increases.

→Increase the width of the board.

· As the board thickness (

h) decreases, the amount of strain increases.

→Increase the thickness of the board.

Since the board thickness is squared, the eect on the amount of strain

becomes even greater.

Continued from the preceding page.

: Strain on center of board (µst)

L: Distance between supporting points (mm)

w: Board width (mm)

h: Board thickness (mm)

E: Elastic modulus of board (N/m2=Pa)

Y: Deﬂection (mm)

P: Load (N)

Continued on the following page.

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