GRM0332C2A6R9DA01 datasheet(82/89 Pages) MURATA1

82 / 89 page

C02E.pdf

Nov.27,2017

Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

283

Notice

1. Operating Temperature

1. The operating temperature limit depends on the capacitor.

1-1. Do not apply temperatures exceeding the maximum

operating temperature.

It is necessary to select a capacitor with a suitable

rated temperature that will cover the operating

temperature range.

It is also necessary to consider the temperature

distribution in equipment and the seasonal

temperature variable factor.

1-2. Consider the self-heating factor of the capacitor.

The surface temperature of the capacitor shall not

exceed the maximum operating temperature including

self-heating.

2. Atmosphere Surroundings (gaseous and liquid)

1. Restriction on the operating environment of capacitors.

1-1. Capacitors, when used in the above, unsuitable,

operating environments may deteriorate due to the

corrosion of the terminations and the penetration of

moisture into the capacitor.

1-2. The same phenomenon as the above may occur when

the electrodes or terminals of the capacitor are subject

to moisture condensation.

1-3. The deterioration of characteristics and insulation

resistance due to the oxidization or corrosion of

terminal electrodes may result in breakdown when the

capacitor is exposed to corrosive or volatile gases or

solvents for long periods of time.

3. Piezo-electric Phenomenon

1. When using high dielectric constant type capacitors in AC

or pulse circuits, the capacitor itself vibrates at speciﬁc

frequencies and noise may be generated.

Moreover, when the mechanical vibration or shock is

added to the capacitor, noise may occur.

Rating

Soldering and Mounting

1. PCB Design

1. Notice for Pattern Forms

1-1. Unlike leaded components, chip components are

susceptible to ﬂexing stresses since they are

mounted directly on the substrate.

They are also more sensitive to mechanical and

thermal stresses than leaded components.

Excess solder ﬁllet height can multiply these stresses

and cause chip cracking. When designing substrates,

take land patterns and dimensions into consideration

to eliminate the possibility of excess solder ﬁllet

height.

1-2. There is a possibility of chip cracking caused by PCB

expansion/contraction with heat, because stress on

a chip is dierent depending on PCB material and

structure. When the thermal expansion coecient

greatly diers between the board used for mounting

and the chip, it will cause cracking of the chip due to

the thermal expansion and contraction.

When capacitors are mounted on a ﬂuorine resin

printed circuit board or on a single-layered glass

epoxy board, it may also cause cracking of the chip

for the same reason.

1-3. Because noise is suppressed by shunting unwanted

high-frequency components to the ground, when

designing a land for the NFM series, design the

ground pattern to be as large as possible in order to

better bring out this characteristic.

As shown in the ﬁgure below, noise countermeasures

can be made more eective by using a via to connect

the ground pattern on the chip mounting surface to a

larger ground pattern on the inner layer.

Continued on the following page.

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