GRM0332C2A6R9DA01 datasheet(64/89 Pages) MURATA1

64 / 89 page

C02E.pdf

Nov.27,2017

Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

265

Caution/Notice

GRM, GR3, GRJ, GR4, GR7, GJM,

GQM, GA2, GA3, LLL, LLA, LLM,

LLR, NFM, KRM, KR3, GMA, GMD

Caution

Notice

Storage and Operation Conditions .................................. 266

Rating .......................................................................................... 266

1. Temperature Dependent Characteristics............ 266

2. Measurement of Capacitance .................................. 266

3. Applied Voltage and Applied Current.................... 267

4. Type of Applied Voltage and

Self-heating Temperature ......................................... 267

5. DC Voltage and AC Voltage Characteristics ...... 270

6. Capacitance Aging ........................................................ 270

7. Vibration and Shock...................................................... 271

Soldering and Mounting ....................................................... 271

1. Mounting Position.......................................................... 271

2. Information before Mounting.................................... 272

3. Maintenance of the Mounting

(pick and place) Machine............................................ 272

4-1. Reﬂow Soldering ....................................................... 273

4-2. Flow Soldering............................................................ 275

4-3. Correction of Soldered Portion............................ 276

5. Washing............................................................................. 277

6. Electrical Test on Printed Circuit Board ............... 277

7. Printed Circuit Board Cropping ................................ 277

8. Assembly........................................................................... 280

9. Die Bonding/Wire Bonding......................................... 281

Other............................................................................................ 281

1. Under Operation of Equipment................................ 281

2. Other................................................................................... 282

Rating .......................................................................................... 283

1. Operating Temperature .............................................. 283

2. Atmosphere Surroundings

(gaseous and liquid)...................................................... 283

3. Piezo-electric Phenomenon ...................................... 283

Soldering and Mounting ....................................................... 283

1. PCB Design....................................................................... 283

1. Notice for Pattern Forms ...................................... 283

2. Land Dimensions....................................................... 284

3. Board Design .............................................................. 288

2. Adhesive Application.................................................... 288

3. Adhesive Curing ............................................................. 289

4. Flux for Flow Soldering ................................................ 289

5. Flow Soldering................................................................. 289

6. Reﬂow Soldering............................................................ 289

7. Washing............................................................................. 290

8. Coating............................................................................... 290

Other............................................................................................ 290

1. Transportation................................................................ 290

2. Characteristics Evaluation

in the Actual System.................................................... 290

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