GRM0332C2A6R9DA01 datasheet(76/89 Pages) MURATA1

76 / 89 page

C02E.pdf

Nov.27,2017

Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

277

Caution

3-2. A soldering iron with a tip of ø3mm or smaller should

be used. It is also necessary to keep the soldering iron

from touching the components during the re-work.

3-3. Solder wire with ø0.5mm or smaller is required for

soldering.

4. For the shape of the soldering iron tip, refer to the ﬁgure

on the right.

Regarding the type of solder, use a wire diameter of

ø0.5mm or less (rosin core wire solder).

4-1. How to Apply the Soldering Iron

Apply the tip of the soldering iron against the lower

end of the metal terminal.

1) In order to prevent cracking caused by sudden

heating of the ceramic device, do not touch the

ceramic base directly.

2) In order to prevent deviations and dislocating of

the chip, do not touch the junction of the chip and

the metal terminal, and the metal portion on the

outside directly.

4-2. Appropriate Amount of Solder

The amount of solder for corrections by soldering iron,

should be lower than the height of the lower side of

the chip.

Cross Section

(in mm)

R0.5

Apply the tip of the soldering iron only

on the terminal portion, without touching

the body of the chip.

Tip of Soldering Iron

Tip temperature: 350°C or less/

5 sec. or less/60W or less

Copper Land

Wire Solder

6. Electrical Test on Printed Circuit Board

1. Conﬁrm position of the support pin or speciﬁc jig, when

inspecting the electrical performance of a capacitor aer

mounting on the printed circuit board.

1-1. Avoid bending the printed circuit board by the

pressure of a test-probe, etc.

The thrusting force of the test probe can ﬂex the

PCB, resulting in cracked chips or open solder joints.

Provide support pins on the back side of the PCB to

prevent warping or ﬂexing. Install support pins as

close to the test-probe as possible.

1-2. Avoid vibration of the board by shock when a

test-probe contacts a printed circuit board.

7. Printed Circuit Board Cropping

1. Aer mounting a capacitor on a printed circuit board, do

not apply any stress to the capacitor that causes bending

or twisting the board.

1-1. In cropping the board, the stress as shown at right

may cause the capacitor to crack.

Cracked capacitors may cause deterioration of the

insulation resistance, and result in a short.

Avoid this type of stress to a capacitor.

[Not Recommended]

[Recommended]

Peeling

Test-probe

Support Pin

Test-probe

[Bending]

[Twisting]

5. Washing

Excessive ultrasonic oscillation during cleaning can cause

the PCBs to resonate, resulting in cracked chips or broken

solder joints. Before starting your production process, test

your cleaning equipment/process to insure it does not

degrade the capacitors.

Continued from the preceding page.

Continued on the following page.

GRM0332C2A6R9DA01 датащи(PDF) 76 Page - Murata Manufacturing Co., Ltd

GRM0332C2A6R9DA01 датащи(HTML) 76 Page - Murata Manufacturing Co., Ltd

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89

датащи скачать

ссылки URL