GRM0332C2A6R9DA01 datasheet(72/89 Pages) MURATA1

72 / 89 page

C02E.pdf

Nov.27,2017

Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

273

Caution

4-1. Reﬂow Soldering

1. When sudden heat is applied to the components, the

mechanical strength of the components will decrease

because a sudden temperature change causes

deformation inside the components. In order to prevent

mechanical damage to the components, preheating is

required for both the components and the PCB.

Preheating conditions are shown in table 1. It is required to

keep the temperature dierential between the solder and

the components surface (∆T) as small as possible.

2. When components are immersed in solvent aer mounting,

be sure to maintain the temperature dierence (∆T)

between the component and the solvent within the range

shown in table 1.

Recommended Conditions

[Example of Temperature Conditions for Reﬂow Soldering]

[Allowable Reﬂow Soldering Temperature and Time]

In the case of repeated soldering, the accumulated

soldering time must be within the range shown above.

Temperature

Incase of Lead Free Solder

( ): In case of Pb-Sn Solder

Soldering Time (s)

260

270

280

250

240

230

220

120

Peak Temperature

Atmosphere

Pb-Sn Solder

230 to 250°C

Air

Lead Free Solder

240 to 260°C

Air or N2

60-120 seconds 30-60 seconds

∆T

Gradual

Cooling

Soldering

Preheating

220°C (200°C)

190°C (170°C)

170°C (150°C)

150°C (130°C)

Time

Temperature (°C)

Peak Temperature

Pb-Sn Solder: Sn-37Pb

Lead Free Solder: Sn-3.0Ag-0.5Cu

3. When a capacitor is mounted at a temperature lower

than the peak reﬂow temperature recommended by the

solder manufacturer, the following quality problems can

occur. Consider factors such as the placement of

peripheral components and the reﬂow temperature

setting to prevent the capacitor’s reﬂow temperature

from dropping below the peak temperature speciﬁed. Be

sure to evaluate the mounting situation beforehand and

verify that none of the following problems occur.

• Drop in solder wettability

• Solder voids

• Possible occurrence of whiskering

• Drop in bonding strength

• Drop in self-alignment properties

• Possible occurrence of tombstones and/or shifting on

the land patterns of the circuit board

GRM/GJM/GQM/GR3/

GRJ/KRM/LLR/NFM/GR7 02/03/15/18/21/31

LLL

02/03/15/18/1U/21/31

ZRB

15/18

GR3/GRJ/GRM/KR3/KRM

GA2/GA3/GR4

32/42/43/52/55

LLA/LLM

18/21/31

GQM

∆T<=190°C

∆T<=130°C

Series

Chip Dimension Code

(L/W)

Temperature

Dierential

Table 1

Continued from the preceding page.

Continued on the following page.

GRM0332C2A6R9DA01 датащи(PDF) 72 Page - Murata Manufacturing Co., Ltd

GRM0332C2A6R9DA01 датащи(HTML) 72 Page - Murata Manufacturing Co., Ltd

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89

датащи скачать

ссылки URL