GRM0332C2A6R9DA01 datasheet(80/89 Pages) MURATA1

80 / 89 page

C02E.pdf

Nov.27,2017

Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

281

Caution

1-1. Do not touch a capacitor directly with bare hands

during operation in order to avoid the danger of an

electric shock.

1-2. Do not allow the terminals of a capacitor to come in

contact with any conductive objects (short-circuit).

Do not expose a capacitor to a conductive liquid,

including any acid or alkali solutions.

1-3. Conﬁrm the environment in which the equipment will

operate is under the speciﬁed conditions.

Do not use the equipment under the following

environments.

(1) Being spattered with water or oil.

(2) Being exposed to direct sunlight.

(3) Being exposed to ozone, ultraviolet rays, or

radiation.

(4) Being exposed to toxic gas (e.g., hydrogen sulﬁde,

sulfur dioxide, chlorine, ammonia gas, etc.)

(5) Any vibrations or mechanical shocks exceeding the

speciﬁed limits.

(6) Moisture condensing environments.

1-4. Use damp proof countermeasures if using under any

conditions that can cause condensation.

Other

1. Die Bonding of Capacitors

1-1. Use the following materials for the Brazing alloys:

Au-Sn (80/20) 300 to 320 °C in N2 atmosphere

1-2. Mounting

(1) Control the temperature of the substrate so it

matches the temperature of the brazing alloy.

(2) Place the brazing alloy on the substrate and place

the capacitor on the alloy. Hold the capacitor and

gently apply the load. Be sure to complete the

operation within 1 minute.

2. Wire Bonding

2-1. Wire

Gold wire: 25 micro m (0.001 inch) diameter

2-2. Bonding

(1) Thermo compression, ultrasonic ball bonding.

(2) Required stage temperature: 150 to 200 °C

(3) Required wedge or capillary weight: 0.2N to 0.5N

(4) Bond the capacitor and base substrate or other

devices with gold wire.

9. Die Bonding/Wire Bonding

1. Under Operation of Equipment

Continued from the preceding page.

Continued on the following page.

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