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GRM0332C2A6R9DA01 датащи(PDF) 73 Page - Murata Manufacturing Co., Ltd

номер детали GRM0332C2A6R9DA01
подробное описание детали  Chip Multilayer Ceramic Capacitors for General
PDF  89 Pages
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производитель  MURATA1 [Murata Manufacturing Co., Ltd]
домашняя страница  http://www.murata.com
Logo MURATA1 - Murata Manufacturing Co., Ltd

GRM0332C2A6R9DA01 датащи(HTML) 73 Page - Murata Manufacturing Co., Ltd

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C02E.pdf
Nov.27,2017
!
Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
274
!
Caution
Inverting the PCB
Make sure not to impose any abnormal mechanical shocks to
the PCB.
4. Optimum Solder Amount for Reflow Soldering
4-1. Overly thick application of solder paste results in a
excessive solder fillet height.
This makes the chip more susceptible to mechanical
and thermal stress on the board and may cause the
chips to crack.
4-2. Too little solder paste results in a lack of adhesive
strength on the termination, which may result in
chips breaking loose from the PCB.
4-3. Please confirm that solder has been applied
smoothly to the termination.
<Applicable to NFM Series>
Continued from the preceding page.
Continued on the following page.
100-150µm: NFM15/18/21/3D/31
100-200µm: NFM41
[Guideline of solder paste thickness]
2.5
4.4
1.0
NFM21PS
2.5
3.9
1.0
NFM3DCC/3DPC
NFM31PC/31KC
NFM18PS
3.5
5.5
1.5
NFM41CC/41PC
NFM15CC/15PC
2.2
1.0
0.4
NFM18CC/18PC
NFM21CC/21PC
1.4
2.6
0.6
0.8
1.2
0.05
2.0
1.6
1.2
2.6
1.8
0.8
0.25
0.7
1.3



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