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ADUCM4050BCPZ-R7 датащи(PDF) 20 Page - Analog Devices

номер детали ADUCM4050BCPZ-R7
подробное описание детали  Ultra Low Power ARM Cortex-M4F MCU with Integrated Power Management
PDF  46 Pages
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производитель  AD [Analog Devices]
домашняя страница  http://www.analog.com
Logo AD - Analog Devices

ADUCM4050BCPZ-R7 датащи(HTML) 20 Page - Analog Devices

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ADuCM4050
Data Sheet
Rev. A | Page 20 of 46
ABSOLUTE MAXIMUM RATINGS
Table 20.
Parameter
Rating
Supply
VBAT_ANA1, VBAT_ANA2, VBAT_ADC,
VBAT_DIG1, VBAT_DIG2, and
VREFP_ADC
−0.3 V to +3.6 V
Analog
VDCDC_CAP1N, VDCDC_CAP1P,
VDCDC_OUT, VDCDC_CAP2N, and
VDCDC_CAP2P
−0.3 V to +3.6 V
VLDO_OUT, SYS_HFXTAL_IN,
SYS_HFXTAL_OUT, SYS_LFXTAL_IN,
and SYS_LFXTAL_OUT
−0.3 V to +1.32 V
Digital Input/Output
P0_xx, P1_xx, P2_xx, P3_xx, and
SYS_HWRST
−0.3 V to +3.6 V
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required. θJA can be used for a first-order
approximation of TJ by the following equation:
TJ = TA + (θJA × PD)
where:
TA is ambient temperature (°C).
TJ is junction temperature (°C).
PD is power dissipation (to calculate power dissipation.
Table 21. Thermal Resistance
Package Type
θJA
θJC
Unit
CP-64-17
26.3
1.0
°C/W
ESD CAUTION



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