ADN8835ACPZ-R7 datasheet(7/27 Pages) AD

7 / 27 page

Data Sheet

ADN8835

Rev. B | Page 7 of 27

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

PVINL to PGNDL

−0.3 V to +6 V

PVINS to PGNDS

−0.3 V to +6 V

LDR to PGNDL

−0.3 V to VPVINL

SW to PGNDS

−0.3 V to +6 V

SFB to AGND

−0.3 V to VVDD

AGND to PGNDL

−0.3 V to +0.3 V

AGND to PGNDS

−0.3 V to +0.3 V

VLIM/SD to AGND

−0.3 V to VVDD

ILIM to AGND

−0.3 V to VVDD

VREF to AGND

−0.3 V to +3 V

VDD to AGND

−0.3 V to +6 V

IN1P to AGND

−0.3 V to VVDD

IN1N to AGND

−0.3 V to VVDD

OUT1 to AGND

−0.3 V to +6 V

IN2P to AGND

−0.3 V to VVDD

IN2N to AGND

−0.3 V to VVDD

OUT2 to AGND

−0.3 V to +6 V

EN/SY to AGND

−0.3 V to VVDD

ITEC to AGND

−0.3 V to +6 V

VTEC to AGND

−0.3 V to +6 V

Maximum Current

VREF to AGND

20 mA

OUT1 to AGND

50 mA

OUT2 to AGND

50 mA

ITEC to AGND

50 mA

VTEC to AGND

50 mA

Junction Temperature

125°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature (Soldering, 10 sec)

260°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages, and is

based on a 4-layer standard JEDEC board.

Table 4. Thermal Resistance

Package Type

θJA

ΨJT

ΨJB

Unit

36-Lead LFCSP

1.2

12.3

°C/W

MAXIMUM POWER DISSIPATION

The maximum power that the ADN8835 can dissipate is limited

by the associated rise in junction temperature. The maximum

safe junction temperature for a plastic encapsulated device is

determined by the glass transition temperature of the plastic,

approximately 125°C. Exceeding this limit may cause a shift in

parametric performance or device failure.

The driver stage of the ADN8835 is designed for maximum

load current capability. To ensure proper operation, it is

necessary to observe the corresponding maximum power

derating curves.

Figure 3. Maximum Power Dissipation vs. Ambient Temperature

ESD CAUTION

3.5

3.0

2.5

2.0

1.5

1.0

0.5

AMBIENT TEMPERATURE (°C)

TJ = 125°C

ADN8835ACPZ-R7 датащи(PDF) 7 Page - Analog Devices

ADN8835ACPZ-R7 датащи(HTML) 7 Page - Analog Devices

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27

датащи скачать

ссылки URL