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MC56F81663 датащи(PDF) 46 Page - NXP Semiconductors

номер детали MC56F81663
подробное описание детали  DSC based on 32-bit 56800EX core
PDF  73 Pages
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производитель  NXP [NXP Semiconductors]
домашняя страница  http://www.nxp.com
Logo NXP - NXP Semiconductors

MC56F81663 датащи(HTML) 46 Page - NXP Semiconductors

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Table 12. Current Consumption (Unit: mA) (continued)
Mode
Maximum
Frequency
Conditions
Typical at
3.3 V,
25°C
Maximum
at 3.6 V,
105°C
Maximum
at 3.6V,
125°C
IDD1 IDDA IDD1 IDDA IDD1 IDDA
• PLL disabled
• Repeat NOP instructions
• All peripheral modules, except COP and EWM,
disabled and clocks gated off
• Simple loop running from platform instruction buffer
VLPWAIT
200 kHz
• 32 kHz Device Clock
• Clocked by a 64 kHz external clock source
• Oscillator in power down
• All ROSCs disabled
• Large regulator is in standby
• Small regulator is disabled
• PLL disabled
• All peripheral modules, except COP, disabled and
clocks gated off
• Processor core in wait mode
0.4
7.5
9.0
VLPSTOP
200 kHz
• 32 kHz Device Clock
• Clocked by a 64 kHz external clock source
• Oscillator in power down
• All ROSCs disabled
• Large regulator is in standby.
• Small regulator is disabled.
• PLL disabled
• All peripheral modules, except COP, disabled and
clocks gated off
• Processor core in stop mode
0.4
7.5
9.0
1. No output switching, all ports configured as inputs, all inputs low, no DC loads.
2. In all chip LP modes and flash memory VLP modes, the maximum frequency for flash memory operation is 500 kHz due to
the fixed frequency ratio of 1:2 between the CPU clock and the flash clock when running with 2 MHz external clock input
and CPU running at 1 MHz.
10.3.6 Designing with radiated emissions in mind
To find application notes that provide guidance on designing your system to minimize
interference from radiated emissions:
1. Go to www.nxp.com.
2. Perform a keyword search for “EMC design.”
General
MC56F81xxx, Rev. 1.1, 12/2020
46
NXP Semiconductors



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