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MPC755 датащи(PDF) 47 Page - Motorola, Inc |
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MPC755 датащи(HTML) 47 Page - Motorola, Inc |
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47 / 56 page ![]() MPC755 RISC Microprocessor Hardware Specifications, Rev. 6.1 Freescale Semiconductor 47 System Design Information Figure 27 describes the thermal performance of select thermal interface materials. Figure 27. Thermal Performance of Select Thermal Interface Materials The board designer can choose between several types of thermal interface. Heat sink adhesive materials should be selected based on high conductivity, yet adequate mechanical strength to meet equipment shock/vibration requirements. There are several commercially-available thermal interfaces and adhesive materials provided by the following vendors: The Bergquist Company 800-347-4572 18930 West 78th St. Chanhassen, MN 55317 Internet: www.bergquistcompany.com Chomerics, Inc. 781-935-4850 77 Dragon Ct. Woburn, MA 01888-4014 Internet: www.chomerics.com Dow-Corning Corporation 800-248-2481 Dow-Corning Electronic Materials 2200 W. Salzburg Rd. Midland, MI 48686-0997 Internet: www.dow.com 0 0.5 1 1.5 2 0 10 20 304050 607080 Silicone Sheet (0.006 in.) Bare Joint Floroether Oil Sheet (0.007 in.) Graphite/Oil Sheet (0.005 in.) Synthetic Grease Contact Pressure (psi) |
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