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iC-HTP

DUAL CW P-TYPE LASER DIODE DRIVER

Rev B1, Page 5/51

ABSOLUTE MAXIMUM RATINGS

These ratings do not imply permissible operating conditions; functional operation is not guaranteed. Exceeding these ratings may damage

the device.

Item

Symbol

Parameter

Conditions

Unit

No.

Min.

Max.

G001 VB

Voltage at VB

-0.3

11

V

G002 I(VB)

Current in VB

-20

50

mA

G003 VDD

Voltage at VDD

-0.3

5.5

V

G004 I(VDD)

Current in VDD

-20

1

mA

G005 V()

Voltage at EC1, EC2, MDK1, MDK2,

EMC, SCLK/SCL, MISO/SDA, MOSI/A0,

NCS/A1, DCO, INS/WKR, NCHK

-0.3

5.5

V

G006 I()

Current in CI1, CI2, CIH1, CIH2, EC1,

EC2, MDK1, MDK2, EMC, SCLK/SCL,

MISO/SDA, MOSI/A0, NCS/A1, DCO,

INS/WKR, NCHK, NSTBY, CIL1, CIL2,

MRH1, MRH2

-20

20

mA

G007 V()

Voltage at CI1, CI2, CIH1, CIH2, VBL1,

VBL2, LDA1, LDA2, NSTBY

-0.3

11

V

G008 I(AGND)

Current in VBL1, VBL2

DC current

-1

900

mA

G009 I(LDK)

Current in LDA1, LDA2

DC current

-900

20

mA

G010 Vd()

ESD Susceptibility at all pins

HBM 100 pF discharged through 1.5 kΩ

2

kV

G011 Tj

Operating Junction Temperature

-40

125

°C

G012 Ts

Storage Temperature Range

-40

150

°C

THERMAL DATA

Operating Conditions: VB = 2.8 . . . 11 V (referenced to GND)

Item

Symbol

Parameter

Conditions

Unit

No.

Min.

Typ.

Max.

T01 Ta

Operating Ambient Temperature Range

-40

85

°C

T02 Rthja

Thermal Resistance Chip/Ambient

Mounted on PCB

25

K/W

T03 RthjTP

Thermal Resistance Chip/Thermal Pad

4

K/W

All voltages are referenced to ground unless otherwise stated.

All currents flowing into the device pins are positive; all currents flowing out of the device pins are negative.